Inseto
Inseto

Category Archives: Consumables

Ex-Stock Semiconductor Packages and Lids Key Features

  • Extensive range of hermetic and plastic packages and lids in stock
  • Full traceability on all items
  • Ideal for universities, research institutes, prototyping and test requirements
  • Power Transistor Outline (TO) Packages
  • Hybrid Packages – Ceramic and Metal
  • Ceramic Pin Grid Array Packages (CPGA)
  • Ceramic Quad Flat Pack (CQFP)
  • Ceramic Small Outline Packages (CSOP)
  • Flat Packs
  • Ceramic Small Outline Packages (CSOP)
  • Cerquads – EIJA and JEDEC
  • Cerpacs
  • CERDIPs
  • J Lead Chip Carriers Ceramic
  • Leadless Chip Carriers (LCC)
  • Side Braze Packages
  • Microwave Transistor (Micro-T) Packages
  • Plastic Equivalent Packages
  • Plastic Pin Grid Array Packages (PPGA)
  • Lids for above packages etc.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

High Reliability Hermetic Glass And Ceramic Sealed Assemblies, High Reliability Glass Sealed Feed-Throughs, Ceramic Feed-Throughs, Microwave Assemblies, Detonator Fuses, Vacuum Seals, Optical Component Headers, Hermetic Switch Components, High Pressure Connectors, Military & Civil Aviation Connectors, Custom Sight Glass Windows, Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages

Industry Segments

Microelectronic / Hybrid Assembly Industries, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, Military & Civil Aviation, Telecommunications, Satellite / Space Electronics, Oil Exploration & Production, Wireless Internet Infrastructure, Aerospace, Industrial, Power Semiconductor Assembly etc.

Region

Available from Inseto throught Europe.

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Thermal Management Metal Matrix Materials Key Features

  • Thermal conductivity in X & Y up to 220 W/m°K
  • CTEs as low as 6.4ppm
  • Electroless & electrolytic nickel and gold plating options

Santier’s products include thermal management materials for wireless communication, internet infrastructure, and military, aerospace and industrial applications. Santier specialises in the manufacture of composite metal matrix materials such as copper tungsten (CuW) and copper molybdenum (CuMo). The base material (W or Mo) starts off in powder form, and is then pressed under very high pressure to form a stable block. Copper is then infiltrated into the base material at high temperatures to form a composite blank. SEM testing ensures complete and homogeneous infiltration.

A variety of processes then form the composite blank into its finished shape. These processes include grinding and lapping for exact thickness control, CNC machining to form the various features (pedestals, cut-outs, etc.), EDM for complex and intricate parts, and CMM for verification and measurements of critical dimensions.

The final stage of the process is cleaning and plating to customer requirements. As plating is key to quality, this is all done in-house on automated plating lines.

With the advent of Compound Semiconductor materials such as Gallium Nitride (GaN), it has become ever more critical to dissipate the heat generated by these materials as quickly as possible. For these challenging applications, Santier offers Super-CMC (S-CuMoCu) laminate material. Its thermal conductivity in the Z-axis is significantly higher (290W/m°K) than traditional materials such as CuW and CuMo. Super-CMC can be machined to create cavities and pedestals, brazed to other materials at temperatures up to 950°C, and gold-over-nickel plated.

Santier also offers a wide range of refractory metals such as aluminium, copper, aluminium-graphite, and copper-graphite.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages

Industry Segments

Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.

Santier Website

www.santier.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Santier, Inc., formally Plansee TMS, is a center of excellence for the engineering and manufacture of high thermal conductivity, controlled expansion metal matrix composites for microelectronic housings and assemblies, specialising in copper tungsten (CuW) and copper molybdenum (CuMo).

Other materials include copper-molybdenum-copper (CuMoCu), Super CMC (S-CuMoCu), aluminium graphite (Al-Gr) and copper graphite (Cu-Gr). Fully vertical manufacturing also provides assembly and plating, integrating the custom thermal management materials into hermetic IC packaging and microelectronic housings. Product applications include aerospace, defense, medical, telecoms and communications, plus many other industries around the world.

As the world leader in the manufacture of CuW, CuMo, and other metal matrix composites for thermal management applications i.e. high power semiconductor heatsinks etc., Santier utilises state-of-the-art powder metal technology. Santier maintains uncompromising dedication to continuous improvement in its engineered materials. Constantly-monitored criteria include composition, analysis of trace elements, particle distribution, grain size, tap density and flow characteristics.

Santier is certified to ISO 9001:2015 and AS9100D.

Santier

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages

Industry Segments

Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.

Santier Website

www.santier.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Reflow Soldering Thermodes Key Features

  • Materials include Mo, W, CuW, CuCr & GlidCop
  • Extensive range of plugs and thermocouples
  • Low MOQ’s for design optimisation

Resistance Reflow Soldering is a hot bar bonding process ( thermocompression bonding) in which heat is produced by passing an electrical current through either the parts which are to be soldered or through a thermode (reflow soldering tip) which heats the parts by conduction. The amount of heat produced and the force applied by the thermode are carefully controlled. The solder required at the joint is applied, in controlled amounts, in the form of solder paste, solder pre-forms, or by reflowing the solder on pre-tinned parts. Flux or a cover gas is generally required for production line resistance reflow soldering, although some users report acceptable results without using either.

AIT has been the industry leading manufacturer of resistance reflow soldering thermodes and hot bars for the thermocompression bonding industry for many years. Many customers find AIT because they are trying to save cost on consumable tooling, without sacrificing quality. AIT utilises a full climate-controlled inspection department to ensure high quality tools.  AIT markets a product line of resistance reflow soldering tools and welding electrodes, but still over 50% of their business is in custom-designed tools for thermocompression bonding applications.

  • AIT Reflow Soldering Thermodes

Reflow Soldering Thermodes Technical Downloads

File

AIT Thermodes Cross-Reference Chart

Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Air Bags, Air Bag Detonators, Anti-skid Brake Systems, Electronic Assemblies, Hearing Aids, Intravenous Catheters, Pacemakers, X-Ray Tubes, Battery Fabrication, Battery Packs, Button Cells, Cellular Phones, Laptop Computers, Halide Arc Lamps, Mercury Arc Lamps, Filament Support Wire, Starter Wire to Foil, Sub-Assembly Support Wires, Electronic Components, Connector to Fine Wire Assembly, Mechanical Relays, Microwave Packages, Military Avionics, Potentiometers, Circuit Board Repair, Substrate Links etc.

Industry Segments

Automotive, Medical, Batteries, Lamps, PCB Assembly, Electronic Components, Microelectronic, Microwave, RF, Photonic Assembly, Military & Civil Aviation, Telecommunications, Satellite / Space, Electronics, Oil Exploration & Production, High Reliability Industrial Manufacturing

AIT Website

www.a-i-t.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Welding Electrodes Key Features

  • Parallel gap and opposed welding electrodes
  • Materials include Mo, W, CuW, CuCr & GlidCop
  • Low MOQ’s for design optimisation

Advanced Integrated Technologies ( AIT ) is the industry-leading manufacturer of resistance welding electrodes for all makes of welders, including Palomar/Hughes, Unitek, Avio, MacGregor, and Sunstone Engineering. Efficient manufacturing processes allow AIT to build very affordable electrodes, including parallel gap and opposed welding electrodes, in all RWMA materials. AIT’s standard product line of resistance welding electrodes covers a broad spectrum representing many applications. Despite the diversity of their product line, a very large percentage of custom work is still undertaken, building electrodes to the specification and design of the end user.

Micro resistance welding electrodes come in either square shank or round shank designs, which are built to match the electrode holder design. The round shank electrodes are either single point style used for opposed welding, or they are parallel gap electrodes which have a mirrored left and right side that both touch the weld target on the top side. Examples of this are AIT’s S20 and S23 style electrodes, which are equivalent to the Unitek Unibond C series electrodes. All other styles of micro resistance welding electrodes are square shank parallel gap, and are available either bonded to an insulator, or separate as two individual halves for customers who can set the gap spacing with their electrode holder.

The need to concentrate the welding current and pressure in the area in which the weld is desired often requires the use of special electrode shapes. This need is usually determined simply by examining the application at hand. AIT offers a wide variety of designs from its stock to provide resistance welding electrodes for most applications. These standard electrodes are furnished with either flat or slightly rounded (convex) tip surfaces. These tip surfaces are generally suited to many applications without further modifications. In applications where special tip shapes are desired to provide optimum results, AIT can build to your specifications.

  • AIT Welding Electrodes

Welding Electrodes Technical Downloads

File

AIT Electrodes Cross-Reference Chart

Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Air Bags, Air Bag Detonators, Anti-skid Brake Systems, Electronic Assemblies, Hearing Aids, Intravenous Catheters, Pacemakers, X-Ray Tubes, Battery Fabrication, Battery Packs, Button Cells, Cellular Phones, Laptop Computers, Halide Arc Lamps, Mercury Arc Lamps, Filament Support Wire, Starter Wire to Foil, Sub-Assembly Support Wires, Electronic Components, Connector to Fine Wire Assembly, Mechanical Relays, Microwave Packages, Military Avionics, Potentiometers, Circuit Board Repair, Substrate Links etc.

Industry Segments

Automotive, Medical, Batteries, Lamps, PCB Assembly, Electronic Components, Microelectronic, Microwave, RF, Photonic Assembly, Military & Civil Aviation, Telecommunications, Satellite / Space, Electronics, Oil Exploration & Production, High Reliability Industrial Manufacturing

AIT Website

www.a-i-t.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Advanced Integrated Technologies (AIT) has been manufacturing precision welding electrodes and reflow solder tools since 1975 and has grown to be largest manufacturer of these parts in the world. Inseto has represented AIT in Europe since 1997, so we have a long history of collaboration. In addition to providing tools direct to end-users, AIT is also the preferred supplier to most of the OEMs.

OEM-equivalent products fit all welding, soldering and bonding equipment from leading manufacturers, including Unitek, Miyachi, MacGregor, Hughes, Palomar and Avio etc., with many tools also being manufactured to meet custom specific applications. AIT has the capability to machine parts as small as 35µm (0.0014″) ± 2.5µm (0.0001″).

Five reasons to purchase your parallel gap resistance welding electrodes and solder reflow / hot bar thermodes from us:

  • Evaluation samples available
  • Shorter delivery lead times 
  • Lower prices than the OEM
  • Guaranteed quality
  • Custom designs are readily available
AIT

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Air Bags, Air Bag Detonators, Anti-skid Brake Systems, Electronic Assemblies, Hearing Aids, Intravenous Catheters, Pacemakers, X-Ray Tubes, Battery Fabrication, Battery Packs, Button Cells, Cellular Phones, Laptop Computers, Halide Arc Lamps, Mercury Arc Lamps, Filament Support Wire, Starter Wire to Foil, Sub-Assembly Support Wires, Electronic Components, Connector to Fine Wire Assembly, Mechanical Relays, Microwave Packages, Military Avionics, Potentiometers, Circuit Board Repair, Substrate Links etc.

Industry Segments

Automotive, Medical, Batteries, Lamps, PCB Assembly, Electronic Components, Microelectronic, Microwave, RF, Photonic Assembly, Military & Civil Aviation, Telecommunications, Satellite / Space, Electronics, Oil Exploration & Production, High Reliability Industrial Manufacturing

AIT Website

www.a-i-t.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

Bathtub Packages and Flatpacks Key Features

  • Compression sealed and matched sealed options
  • Complete in-house plating capabilities
  • All packages manufactured to MIL-STD-883 as minimum
  • Full in-house testing capability to MIL-PRF-38534

Egide offers comprehensive solutions to the more traditional hybrid thick-film technologies. It has been manufacturing glass-to-metal-sealed packages since its inception in 1986, so has a long and extensive history with these types of packages. It has numerous conveyor furnaces for all joining process, from low-temperature soldering to high-temperature brazing.

A wide range of bathtub packages (sometimes called “plug-ins”) and flatpacks, usually made from KovarTM, compliments more specialised requirements in the Power & RF markets. Fully automated, computer-controlled electroplating lines ensure that the most critical process in hermetic package manufacturing is under complete control.

Egide offers both compression sealing and matched sealing. In compression-sealed packages, the reliability of the seal is guaranteed by the thermal expansion of glass and metal creating the necessary concentric compressive stress to meet stringent hermeticity requirements. The matched sealing process uses the match of the thermal expansion coefficients of Kovar and glass over a wide temperature range. An oxide layer created between metal and glass provides for the hermeticity and electrical insulation.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.

Industry Segments

Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.

Egide Website

www.egide-group.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Optoelectronic Packages Key Features

  • Wide range of fibre-optic packages
  • Markets include submarine, long-haul, metro, etc.
  • Mix of technologies – metal, HTCC, GTMS, CTMS
  • Dedicated customer-facing Field Application Engineering department

Over the last 2 decades, opto-electronic devices have found their way into various applications like high-speed telecommunication networks, data center interconnection, gas sensing, thermal imaging, gyroscopes, etc. High-speed fiber-optic networks have increased the need for high density complex interconnection solutions. 

Egide’s multilayer high-temperature co-fired ceramic (HTCC) technology, together with complete in-house RF simulation capabilities, makes it a unique player in the market for high frequency / high bit rate packages used for 100G & 400G TOSA/ROSA and modulator designs.

Opto-electronic sensors are used in a wide variety of applications, some of which are in harsh environmental conditions. Egide’s hermetic packaging technology, ensuring protection and interconnection of the opto-electronic ICs, meets the most stringent requirements that these environments impose. Examples are gas sensing in industrial environment, fiber-optic gyroscopes, etc.

Both GTMS (glass-sealed) and CTMS (ceramic-sealed) options are offered, as well as in-house manufactured RF terminals and DC pin assemblies.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.

Industry Segments

Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.

Egide Website

www.egide-group.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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Thermal Imaging HTCC Packages Key Features

  • Packages for cooled and un-cooled detectors
  • Tested for hermeticity to 10-10 cm3/s atm
  • HTCC manufactured in-house
  • Complete assembly and plating in the EU

Egide customs designs and manufactures packages for the thermal imaging market based upon its proven, reliable HTCC (High Temperature Co-fired Ceramic) technology. All ceramic parts are manufactured in-house from basic inks and powders up to the finished multi-layered product, with gold plated tracks and tungsten-filled vias.

Egide governs the components and the design, ensuring tight dimensional control and problem-free integration, resulting in assembled devices of the highest quality and reliability. Glass-sealed packages are also available. All Egide packages are tested for hermeticity to 10-10 cm3/s atm and the high temperature process reduces critical pumping time. The assembled parts can be plated with electrolytic or electroless nickel and electrolytic or electroless gold.

Egide also plates copper tracks on ceramic for high power applications. They offer much more than just the basic package, adding TECs, getter holders, copper pinch-off tubes, window holders and envelopes as required, so that all customers receive a more complete component and save in-house production space for other requirements.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.

Industry Segments

Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.

Egide Website

www.egide-group.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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RF and Microwave Packages Key Features

  • World leader in high frequency & RF transition technology
  • Dedicated customer-facing Field Application Engineering department
  • Target of 100 GHz capability currently under development
  • In-house ceramic (HTCC) capability

Egide designs and manufactures a wide variety of RF packages for various markets. Frequency capabilities range from S-band all the way up the spectrum to V-band.

Its state-of-the-art RF simulation capability, combined with in-house ceramic technology and assembly processes, ensures that the most demanding applications are met for hermeticity, high frequency, and thermal management. Egide’s dedicated Field Application Engineers work directly with customers to ensure that the fully assembled device meets all customers requirements. File sharing using HFSS and SolidWorks ensure that the package designed in collaboration with customers, and manufactured at Egide, performs as required in the relevant frequency band(s).

RF designs can use either KovarTM or aluminium materials as standard, combined with high-temperature co-fired alumina manufactured at Egide. In-house electroless and electrolytic plating complete the assembly, ensuring total process control within Egide.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.

Industry Segments

Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.

Egide Website

www.egide-group.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form