Inseto
Inseto

Category Archives: Consumables

Applied Thin-Film Products (ATP) manufactures high quality thin film circuits. Using substrate material from blue-chip manufacturers, ATP transforms customer designs into finished product by using 100% in-house processes that ensure the highest quality. These processes include mask generation, sputtering and plating, laser drilling / resistor trimming, complete Via capability, Polyimide air bridges, and AuSn deposition.

ATP’S high quality thin film circuits on substrates from As-Fired Alumina to Aluminium Nitride to Fused Silica / Quartz to Silicon, with metalisations including TaN/TiW/Au & films including Ni, Pd & Ti. ATP offers highest quality products and quick turn-around times depending on customers’ specific requirements.

ATP is fully compliant with RoHS and REACH, and all products are exported under EAR 99.

ATP Applied Thin Film Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Thin Film Substrates, Thin Film Metalised Blocks, Thin Film Devices, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices

Industry Segments

Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaics (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.

ATP Website

www.thinfilm.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

ADT manufacture an extensive range of high-quality, hub-less dicing blades to suit a wide variety of cutting and scribing applications, including dicing ceramics, LTCC, glass, metals, sapphire, ferrite, silicon etc.

ADT’s continually develop their hub-less dicing blades to provide reduced wear and improved life with high dimensional accuracy, resulting in precision dicing and excellent cost-of-ownership (CoO).

Choosing the right blade to suit your application is crucial to the success of your dicing process. To offer the widest range of process capabilities, ADT produces three different product families of dicing blade, which are composed of abrasive materials embedded in either resin or metal matrix, including: resin blades, nickel blades and metal sintered blades.

Resin bond Blades are cured under pressure and high temperature, Metal-bond Blades are sintered and Nickel-bond Blades are manufactured using a tightly controlled electroforming process.

ADT - Advanced Dicing Technologies

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.

ADT Website

www.adt-co.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

Precision Metal Stampings Key Features

  • Custom developed stampings in dimensions as small as 100µm (0.004″)
  • Ability to create precision stampings from a variety of metals
  • Most common are aluminium, copper, Molybdenum & Kovar
  • Optional plating – Ni, Au
  • Cladding service also available: metal to metal & solder to metal

Coining makes small metal stampings that are used as jumper chips, bonding pads, covers, heat sinks, lead frames, tabs, terminals or other components on microelectronic assemblies and packages. These precision stampings are used primarily to dissipate heat or provide an interface for an electronic circuit or component.

Coining works with Kovar™ , molybdenum, tungsten, copper, aluminium and various other metallic materials commonly found in metal and ceramic packages. Some of these parts are supplied after nickel plating or gold plating. Other Coining stampings are manufactured from clad strip consisting of two or more metal layers bonded together in a specialty rolling operation, also called metallic bonding.

Coining utilises its own in-house tooling department to review, design and build tooling to customer specifications. They also use progressive dies to create a variety of 3 dimensional configurations, or EDM-built tools to provide extraordinary precision and variety to the geometries of their parts. Coining primarily focuses on two-dimensional microstampings with constant cross-sectional thicknesses less than 0.75mm (0.030″). 

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

Solder Preforms & Ribbon Key Features

  • Complete range of lead-free alloys
  • Au-based for eutectic processing (AuSn, AuGe & AuSi)
  • More than 15,000 tools available, all made in-house
  • Shapes include squares, rectangles, discs, washers, frames & complex custom shapes
  • Thicknesses as small as 5µm (0.0002″) (alloy dependent)

Coining manufactures high quality preforms in all shapes and sizes, including gold-based eutectic die attach solder preforms, e.g. gold tin, gold germanium, gold silicon, etc. Other alloys are also available, which are used to connect electronic circuitry, package electronic circuitry, dissipate heat, or provide an interface for an electronic connection.

For R&D prototype volumes, Coining supplies solder ribbon to the required width and thickness so that the customer can cut the ribbon into the various shapes that may be required in the early stages of a program, when exact die / component sizes may be unknown. This allows for cost-effective R&D, followed by building a tool to the correct size once production is about to commence.

Coining’s fabrication capability is limited only by the physical constraints of the material that is being made. Essentially, if a shape is possible, Coining can make it, quickly, precisely and efficiently.

Coining utilises its in-house tooling department to review, design and build tooling to customer specifications. Coining also uses progressive dies to create a variety of 3 dimensional configurations and uses EDM-built tools to provide extraordinary precision and variety to the geometries of their parts.

They have a wealth of experience manufacturing parts with overall tolerances of ±12.5µm (0.0005″) to ±1.25µm (0.005″) and thickness tolerances of ±2.3µm (0.0001″) to ±12.5µm (0.0005″). Coining has made parts as small as 100µm (0.004″) with a tolerance of ±12.5µm (0.0005″).

Precision stampings are a hallmark of Coining.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

Coining is a diverse world-class manufacturer of interconnect solutions for the microelectronics industry. Coining’s product range can be divided into several groups: bonding wire & ribbon in gold, aluminium, silver, copper, etc.; solder preforms and ribbon in all alloy compositions; precision stampings in a wide range of metals, clad to other metals or solder alloys; & package cover lid assemblies.

Coining is a leading provider of quality fine gold, aluminium and alloyed wire, which is sold to a diverse customer and application base, including hybrid, medical and automotive manufacturers. Coining’s special proprietary wire alloys and doping recipes, combined with its extensive wire manufacturing capabilities in the US and Malaysia, make their products the preferred choice for their global customers.

In 2009, Coining acquired Semiconductor Packaging Materials (SPM) and in May 2011, Coining itself was acquired by AMETEK, Inc., a large public corporation with annual revenues approaching $3 billion and headquartered in Berwyn, PA near Philadelphia, USA. Coining is now part of AMETEK’s Precision and Engineered Materials Business Unit within AMETEK Specialty Metal Products.

Coining is qualified to ISO 9002, QS9000 and ISO14001 and serves the following industries:

  • Military
  • Aerospace
  • Automotive
  • Telecommunications
  • Medical Electronics
  • Fibre Optics
  • Microelectronics
  • Semiconductor Back-end Assembly etc.

Related Products

Further Information

Applications

Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonic Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

MPP is a world leading wire bond wedge tool and die bond tool manufacturer, producing an extensive range of bonding wedges and die attach tooling. Incorporating the former Kulicke and Soffa Microswiss technology, with more than 25 years experience in supplying tooling to the Semiconductor assembly industry, MPP range of bond tools are sold worldwide.

The MPP range of products includes wire bonding tools for fine wire ultrasonic wedge bonding, including Aluminum (Al), Gold (Au), and Copper (Cu) wire bond applications. In addition, MPP also manufacture and develop an extensive range of ultrasonic bonding wedges for RF ribbon bonding applications using Au and Al ribbons.

The range of die bond tools, includes die attach collets, pickup tips, eject needles and epoxy stamping tools, with customs tooling also available on request.

The MPP products are designed to suit all major brands of manual and automatic wire bonding, die bonding equipment, including: K&S, Orthodyne, BESI – Datacon, ASM, Amicra, Delvotec, Palomar, MRSI, Hesse Mechatronics, F&S Bondtec, TPT, Hybond, Westbond, etc.

MPP - Micro Point Pro Bonding Equipment and Consumable Tooling

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wedge Wire Bonding, Ribbon Bonding, Die Bonding, Tab Bonding, Eutectic Die Attach, Die Sorting

Industry Segments

Semiconductor Production, Microelectronic Assembly, Power Semiconductor Assembly, Semiconductor Back-end Assembly, University Research etc.

MPP Website

www.mpptools.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form

Following the acquisition of IDB Technologies, a specialist supplier of high-quality silicon and silica semiconductor wafers to the University, Research and Industrial sectors, Inseto can now supply a wide range of wafer and substrate materials worldwide, with rapid delivery from our large UK inventory.

We also supply pre processed Si wafers with oxidised and nitride coatings, grid patterns and offer custom processing and wafer dicing on a rapid turnaround. Do not hesitate to contact us for further information and to discuss your specific wafer needs, as we are able to provide support on choosing the best wafer or substrate for your particular requirements.

Service enhancements now include:

  • Larger ship from stock inventory
  • More dry wafer storage capacity
  • Brand new wafer packaging & shipping facility
  • Enhanced technical support
  • Faster quotations with more support personnel
  • Extended shipping cut-off times
  • Improved order tracking console
  • Wafer processing and supply accredited to ISO 9001

See our “Knowledge Base Document” for a selection guide to wafer properties.

Inseto

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Graphene, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewable, Energy Harvesting etc.

Industry Segments

Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.

Region

Available Worldwide from Inseto

Request Form

Inseto’s Consumable Division provides assembly materials and machine consumable tooling for the Semiconductor, Microelectronic, Electronic, Photonic, RF and Hybrid assembly industries etc.

Products & services include: semiconductor & silica wafers, sub-contract wafer bumping & dicing, bonding wires & ribbons, plated wire & ribbons, precision stampings, solder spheres & preforms , hermetic glass & ceramic packages, thick film materials, metalised thin film substrates, thermal dissipation materials, welding electrodes & thermodes, plus bonding wedges, capillaries, die collets & dicing blades etc.include gold, aluminium, copper and silver bonding wires and bonding ribbons, precision metal stampings, solder preforms, hermetic glass & ceramic sealed packages, thick film materials (thick film inks), metallised thin film and precision machined ceramics, thermal dissipation materials, welding electrodes and thermodes and die / wire bond assembly consumables including wedges, capillaries and collets, dicing blades etc.

Consumables

Further Information