Inseto
Inseto

Category Archives: Equipment

Key Features:

  • Simple and accurate manual diamond wafer scriber
  • Fast and easy scribing of ceramics, glass, silicon, GaAs, InP and many more
  • No maintenance
  • Multipurpose tool with 4 cutting edges
  • Adjustable scribing force
  • Adjustable substrate thickness
  • Precise step and repeat via mechanical stopper on ruler
  • Alcohol lubrication: longer tool lifetime; enhances cleaving by capillary effect

This reliable Manual Diamond Wafer Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substraits. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous.

All essential operating parameters – the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeatable results.

Features & Specifications

RV126: Max. Cutting Scribe Length/Width

200mm / 100mm

RV127: Max. Cutting Scribe Length/Width

400mm / 100mm

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Cutting, Scribing of: Wafers, Thin Film Devices, PV Materials, Thick Film Components, Glass and Ceramic Substrates etc.

Industry Segments

Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.

ATV Website

www.atv-tech.de

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Request Form

Prospector Key Features

  • True multi-function Micro Materials Test Equipment platform
  • Electrical, Acoustic, Mechanical, Thermal and Optical Test Integration
  • Scratch, Bend & Twist, Creep, Bend, Crush, Push, Shear, Pull Test etc.
  • Plug & play testing capability – Quick changeover in seconds
  • Incorporate external instruments and analogue signals in real time
  • Dynamically heat samples during mechanical testing from -50°C to 155°C
  • Cylindrical-multi-axis force testing; controlled force or displacement in X, Y & Z
  • Acoustic measurement options for hard to resolve material failure modes
  • Integrated optics for high magnification image / video capture of test samples

Nordson DAGE Prospector overview

The Dage Prospector is the most advanced micro materials test equipment on the market; allowing users to perform all their mechanical tests on one platform, with a full complement of interchangeable test modules providing the capability to perform any mechanical test on a new sample immediately.

Micro Materials Testing

The Prospector from Dage supports a variety of Micro (>100um) materials applications helping you define the correct failure modes and define your quality requirements.  Typical applications include:

  • Composites, Plastic and Fibres
  • Connectors
  • Coatings & Thin Films
  • Flexible Electronics
  • Micro Electronics
  • 5G PCB Boards & Components
  • Materials Testing

One Machine, Every Test

Multiple tests can be performed by simply changing to a new test module. You can complete multiple tests in minutes, without needing to move or reposition your device.  And with the Prospector’s customisable XY table, work-holders and fixtures can be added to the system easily providing even greater sample selection from the standard Prospector platform.

  • Prospector Thermo Mechanical Testing

Prospector Micro Materials Test Equipment Downloads

File

Nordson-DAGE Bond Testing Catalogue

Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Automated Semiconductor Defect Analysis & Process Characterisation, Wire Bond Pull Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Bond Shear Strength Checks, Bump Test, Cold-Pull Testing etc.

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Nordson-DAGE Website

www.nordson.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Request Form

Key Features

  • Affordable range of Wafer Probing Accessories
  • Probe tips: Tungsten, gold plated, beryllium copper etc.
  • Manipulators: Vacuum or Magnetic Bases, Variable Travel & Resolution
  • Range of HF, Microwave, Triaxial, Coaxial Probe Arms
  • Probe Card Holders in both 4.5” and 6.0” configurations
  • Miniature Vacuum Pumps suitable for many applications
  • Universal to SemiProbe and Many other OEM Probe Stations

Semiprobe provides a wide range of quality accessories to support their range of Manual, Semi and Fully Automatic Wafer Probing Systems such as the modular Probe System for Life™.

Wafer probe accessories include Probe Tips in various sizes and materials including Tungsten, Tungsten Carbide, Gold plated and Beryllium Copper for probing feature sizes ranging from under 4 microns to in excess of 100 microns to cover every conceivable requirement!

Probe arms are available for high voltage (HV), high frequency (HF) and high current measurement.  Quasi and True Kelvin measurement probe arms are also available in either coaxial or triaxial configuration.  The HF probe arm can also accommodate fibre clamps for optical measurement too.

Semiprobe also provides a range of compact Manipulators supporting all of the probe arm / tip combinations mentioned above.  All manipulators can be fixed to the prober via vacuum, mechanical or magnetic bases, making them truly universal not just to Semiprobe equipment, but all OEMs!  Where individual manipulators are not sufficient, industry standard probe card holders can be fitted to all Semiprobe probe systems (including the Lab assistant!) in either the 4.5” or 6.0” size.

Miniature vacuum pumps and air compressors suitable for wafer probing and many other laboratory applications can also be provided.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Multi-Chip-Modules Testing, Semiconductor Wafer Probe, Device Development & Characterisation, RF-HF Devices, Bio Medical Assemblies, Nanoelectronics, Packaged Device Test, MEMS, Spintronics, Carbon NanoTube, Semiconductor Components, Research Testing, Microfluidic Testing, Photovoltaic Device Test etc.

Industry Segments

University Research, Development & Characterisation, Production Test, Semiconductor Production, Medical, Photonics, Solar Cell, Nanoelectronics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Power Electronics

SemiProbe Website

www.semiprobe.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Request Form

Plasma Treatment Key Features

  • Atmospheric plasma equipment, works without vacuum
  • Low cost and simple to operate
  • Cleans or pre-treats surfaces prior to assembly
  • Wide plasma stream
  • Large working area and working distance
  • Requires no additional facilities except power

The Hand-Held Atmospheric Plasma System is a semi-portable plasma system with 700 watts of cleaning and activating power, perfect for projects where a large area needs to be activated prior to painting, printing, or bonding.

Mounted on wheels with a retractable handle, this system was designed to allow you to work almost anywhere.

The nozzle is capable of producing plasma up to 25 mm wide with a treatment distance of up to 37.5 mm from the plasma head. Rubber guides are available to make uniform cleaning easy, even on large substrates!

The Hand-Held Atmospheric Plasma System uses a nozzle-type plasma generator to activate surfaces. As with all of our systems, it offers consistent and repeatable results.

The system is fully automated and uses a “dual-trigger” safety system. The first trigger prepares the system for use, while the main trigger activates the plasma nozzle. Almost any surface, large or small, can be treated in almost any well ventilated environment.

The plasma nozzle features a cable and gas line up to 4.8M long, allowing the user to comfortably treat a large substrate. A variety of nozzle heads can be used to suit nearly any application.

This system has an on board air compressor so no input gas is required.

Features & Specifications

Treatment Width:

10 – 25 mm

Treatment Distance:

10 – 25 mm

Control System:

Dual triggers control the plasma system from the nozzle.

Generator:

700 Watt

Dimenions:

Width: 600 mm, Height: 750 mm or 1075 mm” with handle extended, Depth: 425 mm including wheels

Weight:

36 KG

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Cleaning and De-Contamination, Hydrophilic Surface Modification, Surface Preparation Prior to Bonding or Printing etc.

Industry Segments

Printing, Medical, Ophthalmic, Plastic, Glass, Automotive, Aerospace, Military, Telecommunications, Electronics, Industrial, Printed Circuit Board etc.

Plasma Etch Inc. Website

www.plasmaetch.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark, Netherlands, France & Benelux

Request Form

8020 Series Key Features

  • Unique wafer handling system streamlines productivity
  • Continuous digital magnification system for optimal vision setup
  • Special algorithm predicts blade wear rates
  • Blade wear algorithm reduces height measurements & increases UPH
  • Touch panel display supports a user-friendly graphical interface (GUI)
  • Atomized wafer cleaning technology for superior process results
  • Dedicated dressing cassette enables automatic blade dressing
  • Built-in Inspection tray allows for in-process quality assessment

With advanced architecture and sophisticated process control tools, the 7220 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications.

The 7220 series is available in configurations for IC wafer applications, package dicing or hard material applications, with systems available for up to 300mm (12″) substrates / wafers, models include:

The 7222 is optimised for dicing a variety of products up to 200mm diameter, such as: Silicon wafers, Thin-film devices, High-brightness LED packages, SAW filters, Glass wafers, IR filters & PZT transducers etc. for The system features a 1.2 KW, 2″ Air-bearing spindle, DC-brushless up to 60krpm. It is compatible with 2″- 3″ hub and annular blades.

The 7223 is a higher power (2.4 KW) version of the 7222 system, ideal for package singulation and IC dicing applications.

The 7224 is a high power automatic dicing system that is optimized for thick and hard materials including: Ceramic substrates, Alumina (LTCC, HTCC) & Hybrids etc. It features a 4″ Air-bearing spindle, DC- brushless, up to 2.5KW at 30krpm and is compatible with 4″ and 5” annular blades.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Dicing Semiconductor Wafers, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing or Dicing Ceramic Components, Cutting Glass, Dicing MEMS Devices, PCB Package Singulation etc., Passive Component Green Ceramic Cutting.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Filter Manufacturing

ADT Website

www.adt-co.com

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

Request Form

K&S is the world leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 – 80 x 12 mils).

For over 45 years, K&S wedge bonder products have been recognized for exceptional performance, reliability, and excellent after-sales support. Its bonders are created to cater to industries’ needs of smaller, thinner, and denser semiconductor packages.

K&S - Kulicke and Soffa

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Kulicke & Soffa (K&S) Website

www.kns.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Request Form

Tresky T-3002-PRO Key Features

  • Semiautomatic Die Attach and Die Sorter
  • Pickup die from up to 200mm wafer
  • Suitable for all kind of Si, GaAs and InP dies down to 30µm thickness
  • Automated Z-Drive with bond force control
  • Touch-PC control software for ease of setup and operation
  • For: Epoxy, eutectic, solder, flip chip & sinter die bonding processes etc.
  • Precision die to die and die on die placement capability
  • Integrated time pressure dispenser, optional stamping unit
  • Simple to use with excellent ergonomics & high build quality
  • Modular system covers virtually all die pick-place applications

The T-3002-PRO is a high precision, operator controlled semiautomatic die attach and die sorter machine for picking and placing bare semiconductor devices from up to 200mm (8″) wafer or 2/4″ waffle packs or GEL paks, passive components and other devices used in microelectronic and related assemblies.

The PRO equipped systems incorporate a motorised Z axis, providing active force measurement on every pickup and placement removing operator induced variation, which is ideal for the bonding of delicate devices and for providing precise control of bondline thickness.

The equipment features superior ergonomic design, high-accuracy and a large 220 x 220mm assembly area with 95mm of Z travel, making it ideal for R&D through low volume production or custom assembly requirements.

Applications include:

  • Assembly of Hybrid Microelectronic Devices
  • Conductive & Non Conductive Epoxy Die Attach
  • Eutectic Soldering of Devices
  • Flip Chip Bonding
  • Thermo-compression & Ultrasonic Bonding
  • Epoxy Die Attach with Adhesive Dispense or Stamping
  • Laser Bar Stacking and Unstacking
  • PCB Chip-on-Board Assembly etc.
  • Die Sorting to Waffle or Gel Pak

All models feature Treskys’ True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height, plus integrated time/pressure dispensers.

The modular T-3002-PRO Die Attach and Die Sort system also includes an extensive range of options, comprising: Beam splitters for Flip-chip applications, Eutectic Scrub & Gas Heating for Eutectic Die Attach, Solder / Epoxy Dispenser, Epoxy Stamping, Pickup Tool Heating, Ultrasonic Bond Heads, Secondary Preform Spindle, Flip Chip Station, Waffle & Gel Pak Tooling, Substrate Holders, Static and Dynamic Heating Plates and alignment / inspection options.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Die Sort, Semiconductor Die Bonding, Chip-on-Board Assemblies, Multi-Chip-Modules, Research and Development, Bio Medical Assembly, MEMS Device Interconnect, RFID, MOEMS, VCSEL, Eutectic Die Attach, Epoxy Die Attach etc.

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Tresky Website

www.tresky.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Request Form

Tresky T-3000-PRO Key Features

  • Semiautomatic Die Bonder for precision assembly
  • Automated Z-Drive with bond force control
  • Touch-PC control software for ease of setup and operation
  • For epoxy, eutectic-solder, flip chip & sinter die attach processes etc.
  • Precision die to die and die on die placement capability
  • Integrated time pressure dispenser, optional stamping unit
  • True Vertical Technology™, ensures die parallelism during bonding
  • Simple to use with excellent ergonomics & high build quality
  • Modular system covers virtually all die pick-place applications

The T-3000-PRO semiautomatic die bonder is a high precision, operator controlled machine for picking and placing bare semiconductor and related devices from waffle packs or GEL paks, passive components and other devices used in microelectronic and related assemblies.

The PRO equipped systems incorporate a motorised Z axis, providing active force measurement on every pickup and placement removing operator induced variation, which is ideal for the bonding of delicate devices and for providing precise control of bondline thickness.

The equipment features superior ergonomic design, high-accuracy and a large 220 x 220mm assembly area with 95mm of Z travel, making it ideal for R&D through low volume production or custom assembly requirements.

Applications include:

  • Semiautomatic Die Bonding of Microelectronic Devices
  • Conductive & Non Conductive Epoxy Die Attach
  • Eutectic Soldering of Devices
  • Flip Chip Bonding
  • Thermo-compression & Ultrasonic Bonding
  • Epoxy Dispense or Stamping
  • Laser Bar Stacking and Unstacking
  • PCB Chip-on-Board Assembly etc.
  • Die Sorting to Waffle or Gel Pak

All models feature Treskys’ True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height, plus integrated time/pressure dispensers.

The modular T-3000-PRO semiautomatic die bonder also includes an extensive range of options, comprising: Beam splitters for Flip-chip applications, Eutectic Scrub & Gas Heating for Eutectic Die Attach, Solder / Epoxy Dispenser, Epoxy Stamping, Pickup Tool Heating, Ultrasonic Bond Heads, Secondary Preform Spindle, Flip Chip Station, Waffle & Gel Pak Tooling, Substrate Holders, Static and Dynamic Heating Plates and alignment / inspection options.

  • Tresky T-3000-PRO Semiautomatic Die Bonders

Tresky T-3000-PRO Semiautomatic Die Bonder Downloads

File

T-3000-PRO Motorised Z Axis with Pick up from Waffle / Gel-Pak

Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Bio Medical Assembly, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, RFID, MOEMS, VCSEL, Eutectic Die Attach, Adhesive Die Bonding

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Tresky Website

www.tresky.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Request Form

AS8/12 Key Features

  • Compact Wafer Coating Equipment
  • Uniform coating even of highly structured surfaces
  • Substrate sizes up to 200mm in diameter
  • Square substrates up to 6″ edge length
  • SUSS Microtec spray design for optimal process stability
  • Up to 2 independent spray dispense systems
  • Recipe controlled process parameters

SUSS Microtec’s AS8 and AS12 platforms are the ideal tools for R&D and low-volume device fabrication.  The systems can process wafers up to 200mm or 300mm diameter respectively, with a maximum 150mm x 150mm edge length for square substrates.

The SUSS Microtec AS8/AS12 series Spray Coaters can be equipped with two independent spray dispense systems avoiding cross contamination; SUSS Microtec’s proprietary spray design, coupled with the sophisticated resist supply system, provides unmatched process stability, repeatability and reproducibility.

All spray and cleaning parameters are programmed and controlled in the on board recipe; this allows for system program transfer to SUSS Microtec’s range of automated tools when the customer see the need for higher throughput.

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

SÜSS MicroTec Website

www.suss.com

Region

United Kingdom and Ireland

Request Form

Microprof® 200mm Metrology Inspection Tool Key Features

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MA/BA Gen4 Series Mask Aligner for Pieces, Small Substrates and Wafers up to 150mm

The compact, easy to use MA/BA Gen4 Series is a manually loaded system that sets the benchmark in semiconductor submicron research and microsystems production. It is available in three different models, dependent upon the customers applications and requirements. Features and capabilities include:

  • Processing of fragile, warped or part wafers and pieces from a few millimetres up to 150mm
  • Top side, bottom side & infrared alignment capabilities
  • UV250/300/400 Diffraction-reducing exposure optics with fast switching between different wavelengths
  • Precision alignment with either split field microscope or video based targeting
  • Wedge Error Compensation (WEC) for optimal parallelism between substrate and mask
  • Optional Bond Alignment, UV-Nanoimprint Lithography capability
  • MicroProf 200mm Metrology Inspection Tool

Microprof® 200mm Metrology Inspection Tool Technical Downloads

File

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Download

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Inspection, Wafer Bond Alignment, Wafer Bonding

Industry Segments

Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications

FRT Website

www.frtmetrology.com

Region

United Kingdom, Ireland & Nordic region

Request Form