Category Archives: Lithography
Introduction to the micro and nano imprint lithography.
Oxide Coated Wafer Overview – SiO2
This article explains the types, primary properties and example applications for the most popular semiconductor oxide wafer coating, Silicon Dioxide (SiO2).
Introduction to the basics of photolithography.
Photolithography Exposure Modes
Introduction to the exposure modes used in Mask Aligner photo lithography.
Resist Coating Methods
Resist Coating Methods overviews spin coat, spray coat, inkjet print, dip and slot die coating processes for semiconductor photo resists.
Semiconductor Wafer Nomenclature
This article explains the nomenclature used to identify our semiconductor wafer types and specifications, along with the key descriptive criteria to consider when choosing wafers.
Semiconductor Wafer Selection Guide
A guide to semiconductor wafer selection, explaining what the meaning of the various parameters in our wafer nomenclature charts.
Wafer Bonding Methods
Wafer Bonding Methods overviews the different wafer bonding methods used in semiconductor manufacturing.
What Is A Mask Aligner?
What is a mask aligner? It is a precision instrument used to transfer a pattern (with micro- / nano-scale features) onto a wafer or substrate during the semiconductor manufacturing process. Read more about all five components here in our Knowledge Base!
What Is A Wafer Bonder?
What is a wafer bonder? A wafer bonder is a precision machine tool used in the fabrication of micro-electrical mechanical systems (MEMS) and other similar technologies. A wafer bonder is used to package together two or more substrates on the wafer-level.
What Is Spin Coating?
What is Spin Coating? This Knowledge Base document overviews the semiconductor fabrication process known as spin-coating, and explains how it works.