Category Archives: Lithography
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Imprint Photolithography
Introduction to the micro and nano imprint lithography.
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Oxide Coated Wafer Overview – SiO2
This article explains the types, primary properties and example applications for the most popular semiconductor oxide wafer coating, Silicon Dioxide (SiO2).
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Photolithography Basics
Introduction to the basics of photolithography.
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Photolithography Exposure Modes
Introduction to the exposure modes used in Mask Aligner photo lithography.
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Resist Coating Methods
Resist Coating Methods overviews spin coat, spray coat, inkjet print, dip and slot die coating processes for semiconductor photo resists.
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Semiconductor Wafer Nomenclature
This article explains the nomenclature used to identify our semiconductor wafer types and specifications, along with the key descriptive criteria to consider when choosing wafers.
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Semiconductor Wafer Selection Guide
A guide to semiconductor wafer selection, explaining what the meaning of the various parameters in our wafer nomenclature charts.
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Wafer Bonding Methods
Wafer Bonding Methods overviews the different wafer bonding methods used in semiconductor manufacturing.
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What Is A Mask Aligner?
What is a mask aligner? It is a precision instrument used to transfer a pattern (with micro- / nano-scale features) onto a wafer or substrate during the semiconductor manufacturing process. Read more about all five components here in our Knowledge Base!
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What Is A Wafer Bonder?
What is a wafer bonder? A wafer bonder is a precision machine tool used in the fabrication of micro-electrical mechanical systems (MEMS) and other similar technologies. A wafer bonder is used to package together two or more substrates on the wafer-level.
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What Is Spin Coating?
What is Spin Coating? This Knowledge Base document overviews the semiconductor fabrication process known as spin-coating, and explains how it works.
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