Inseto
Inseto

Contents

Category Archives: Wire Bonding

Wire Bonding General

  • Battery Bonding Best Practice

    A new Inseto Knowledge Base document providing an overview of Wirebonding Lithium-Ion Battery Packs versus Laser Welded connections.

  • Fine Wire Bonding Explained

    This document explains the process of fine wire bonding using either the ball or wedge bond process and concludes with a comparison of the two.

  • What is Wire Bonding?

    This document explains the different wire bonding process techniques, including ultrasonic wedge, thermosonic ball, thermocompression and ribbon, used to wire bond devices in microelectronics assembly.

  • Wire Bonding Battery Connections

    Wire and ribbon of bonding Lithium-Ion battery connections delivers considerable benefits in power pack volume production. This document reviews materials, production considerations and bonding machine capabilities.

Wire Bonding Manual Bonders

  • Ball Bond Sequence

    This document explains the ball bonding cycle used to ultrasonically bond electrical interconnects in microelectronic devices.

  • Fine Wire Wedge Bond Sequence

    This document explains the fine wire wedge-wedge bonding cycle used to ultrasonically weld electrical interconnects in microelectronics.

  • MPP & KnS NEFO Setup

    This document explains the MPP & KnS Manual Wire Bonder, NEFO Ball Setup Adjustments (IKB-022).

Wire Bonding Accessories

  • Kulicke & Soffa Capillary Nomenclature

    Explanation of common features and selection criteria for ball bond capillaries from Kulicke & Soffa, along with the key selection criteria to consider when choosing capillaries.

  • MPP Bonding Wedge Tool Nomenclature

    This article explains the nomenclature used to identify Micro Point Pro’s bonding wedge tools for wire and ribbon bonding, along with the key selection criteria to consider when choosing bond tools.