Category Archives: Wire Bonding

Wire Bonding General

• Battery Bonding Best Practice

  A new Inseto Knowledge Base document providing an overview of Wirebonding Lithium-Ion Battery Packs versus Laser Welded connections.

• Fine Wire Bonding Explained

  This document explains the process of fine wire bonding using either the ball or wedge bond process and concludes with a comparison of the two.

• Heavy Wire Wedge Bonding Cycles

  An overview of the different bond head movements on an automated heavy (large) wire bonder.

• KnS Understanding Pattern Recognition

  Explanation of pattern recognition systems used on automatic Kulicke and Soffa (KnS) ball and bump bonders.

• What is Wire Bonding?

  This document explains the different wire bonding process techniques, including ultrasonic wedge, thermosonic ball, thermocompression and ribbon, used to wire bond devices in microelectronics assembly.

• Wire Bonding Battery Connections

  Wire and ribbon of bonding Lithium-Ion battery connections delivers considerable benefits in power pack volume production. This document reviews materials, production considerations and bonding machine capabilities.

Wire Bonding Manual Bonders

• Ball Bond Sequence

  This document explains the ball bonding cycle used to ultrasonically bond electrical interconnects in microelectronic devices.

• Fine Wire Wedge Bond Sequence

  This document explains the fine wire wedge-wedge bonding cycle used to ultrasonically weld electrical interconnects in microelectronics.

• MPP & KnS 30/45 Degree Clamp Adjustments

  This document explains the MPP & KnS Manual Wire Bonder, 30 and 45 degree Clamp Adjustments (IKB-021)

• MPP & KnS Adjusting Bond Force Settings

  This document explains the MPP & KnS Manual Wire Bonder, Adjustments for Bond Force Settings (IKB-009).

• MPP & KnS Deep Access Clamp Adjustments

  This document explains the MPP & KnS Manual Wire Bonder, Deep Access Clamp Adjustments (IKB-007)

• MPP & KnS How to Measure Static Bond Force

  How to measure the static bond force on Micro Point Pro & Kulicke and Soffa (K&S) manual wire bonders.

• MPP & KnS Manual Workholder Setup

  This document explains the MPP & KnS Manual Wire Bonder, Workholder Setup and Adjustments (IKB-006).

• MPP & KnS NEFO Setup

  This document explains the MPP & KnS Manual Wire Bonder, NEFO Ball Setup Adjustments (IKB-022).

Wire Bonding Accessories

• Bond Wire Handling Considerations

  A guide on how to correctly handle and store bonding wire.

• Bonding Wire Sizes and Selection

  Bonding Wire Selection: What considerations are needed to be taken into account when selecting a wire for wire bonding?

• Kulicke & Soffa Capillary Nomenclature

  Explanation of common features and selection criteria for ball bond capillaries from Kulicke & Soffa, along with the key selection criteria to consider when choosing capillaries.

• MPP Bonding Wedge Tool Nomenclature

  This article explains the nomenclature used to identify Micro Point Pro’s bonding wedge tools for wire and ribbon bonding, along with the key selection criteria to consider when choosing bond tools.

• MPP Ribbon Tool: Slot Size to Ribbon Size

  This article explains the relationship between the wire feed hole size and recommended wire diameter used on Micro Point Pro’s fine wire bonding wedge tools

• MPP Wedge Tool: Feed Hole to Wire Diameter

  This article explains the relationship between the wire feed hole size and recommended wire diameter used on Micro Point Pro’s fine wire bonding wedge tools