Inseto
Inseto

Contents

Category Archives: Wire Bonding Manual Bonders

  • Ball Bond Sequence

    This document explains the ball bonding cycle used to ultrasonically bond electrical interconnects in microelectronic devices.

  • Fine Wire Wedge Bond Sequence

    This document explains the fine wire wedge-wedge bonding cycle used to ultrasonically weld electrical interconnects in microelectronics.

  • MPP & KnS NEFO Setup

    This document explains the MPP & KnS Manual Wire Bonder, NEFO Ball Setup Adjustments (IKB-022).