DELO MONOPOX TC2270, a new specialist adhesive ideal for chip bonding – and other applications where electrically insulated heat transfer is required – is now available from Inseto.
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, is now supplying DELO’s new MONOPOX TC2270, a thermally conductive, electrically insulating adhesive, which is ideal for bonding silicon die and other applications where rapid heat transfer is essential.
For example, heat build-up is a common reason for
integrated circuit failure and the efficient dissipation of heat in power
semiconductors, as used increasingly in automotive applications, is a
considerable challenge. With a specific thermal conductivity of 1.7 W/mK, DELO
MONOPOX TC2270 ensures efficient heat transfer between die and packaging. It is
also cheaper than silver epoxy, which has the often-unwanted property of being
electrically as well as thermally conductive.
Supplied in 10ml syringes, DELO MONOPOX TC2270
boasts many other benefits too. For instance, the minimum curing temperature is
60oC in about 90 minutes, which means it can be used with temperature
sensitive materials with little risk of introducing stress or causing warpage.
In addition, it is a one-part adhesive, so no mixing is required and storage is
at -18oC, a temperature accommodated by standard commercially
available freezers; whereas most die-attach adhesives need to be stored in
industrial freezers at much lower temperatures, such as -40oC.
Once cured, DELO MONOPOX TC2270 delivers a die
shear strength of 60N/mm2 and has an end-application use range of
-40 to +150oC, which is more than adequate for most silicon-based
Eamonn Redmond, Sales Manager of Inseto,
comments: “The adhesive’s chemistry includes aluminium nitride, which ensures
heat is quickly transferred away from the die, thus increasing the potential
lifetime of the chip. Also, the fact that it is readily available in 10ml
syringes means that users reduce the risk of having to dispose of out-of-date
In addition to its good shear strength, DELO
MONOPOX TC2270 boasts a relatively high flexibility (11% compared to the less
than 2% exhibited by most epoxies), making it ideal for bonding larger die. It
also has a very low water absorption figure of just 0.1% and, once cured, volume resistivity is greater
than 1xE14 Ohm cm and its surface resistance is greater than 1xE13 Ohms.
DELO MONOPOX TC2270 has an anticipated shelf life of six months. The datasheet for this adhesive, along with others from the DELO MONOPOX one-part, heat-cured epoxies range, can be viewedonline at Inseto’s website, which also contains the datasheets of other adhesive types (chemistries, curing methods etc.) and an extensive Knowledge Base library of articles and guidance notes.
Redmond concludes: “The TC2270 is an extremely useful adhesive in the world of microelectronics and in any application where heat must be transferred without establishing an electrical connection.” Inseto is DELO Industrial Adhesives’ exclusive distributor in the UK and Ireland. Other products available through Inseto include an extensive range of UV cured or light activated epoxies, light cured acrylates, light / heat cured epoxies, dual curing materials, light / anaerobic curing adhesives, 2-part polyurethanes, 1- & 2-part epoxies, cyanoacrylates and single part silicones.
With some 90 visitors attending from industry and academia, the inaugural SUSS MicroTec sponsored “UK Lithography Conference”, held on 4th July 2019, had an over-arching theme of ‘productivity and efficiency’ and was a resounding success.
Rutherford Appleton Laboratory, the conference was split into three sessions, the
first of which was entitled ‘Surface Preparation’, which began with sound advice
on substrate selection. For this, Ian Burnett of Inseto, had a clear message: quality
lithography depends heavily on quality wafers. Though SEMI standards exist for
wafer thickness tolerances, flatness, surface roughness etc. for repeat runs,
and to ensure consistent results, there is no substitute for using wafers from
the same ingot, supplied in the order in which they were sliced.
Next in the
session, Joost Driven and Dominique Bouwes of Micronit Mictrotechnologies discussed
material structures, focussing on the benefits of polymer and the associated
challenges of processing it; challenges that include ensuring a crack-free
surface, structural accuracy (i.e. dimensions of features), cleanliness (of
channels, trenches and holes) and adhesion. Figure 1 shows how cracks can form.
Bouwes than gave examples of polymer-based devices; a bio chip for life
sciences and a MEMS-based hair flow sensor.
session concluded with Tim Bruchmueller, Product Manager 200mm coaters, of SUSS
MicroTec discussing recent developments with coating technologies in the SUSS
camp. Using the just-launched SUSS ACS 200 GEN3 LabCluster coater and developer
as an example, and without being overly sales-pitchy, Bruchmueller explained
how, for example, developments around the resist bottle (which is inverted)
reduce the risk of getting air into the dispensers.
Also, by taking advantage of the Peltier-Effect (as exhibited by some semiconductors) means positive or negative temperature differentials can be created for heating or cooling purposes. Where cooling is concerned this means no need for compressors (and their associated vibrations) and refrigerant liquids. Perhaps the biggest benefit is a lower electricity bill, as reflected in figure 2.
for this session was Exposure, and Dr. Marc Hennemeyer, Director of SUSS
MicroTec’s Application Centre for Lithography, started proceedings by giving a
presentation on MEMS processing challenges. These include needing consistent
processing for different types of substrate material (Si, SiO2,
LiTa, ceramics etc.) and the popularity of material stacks (for example,
Si-based CMOS device wafers on top of mechanical device wafers).
relatively large features on substrates with high topographies, large exposure
gaps are caused. However, this can lead to reduced side wall angles. Also,
steppers cannot achieve sufficient process results due to their limited depth
of focus (DOF). In this respect, Dr. Hennemeyer proposed Fresnel Zone Plate
(FZP) processing as a solution, describing FZP as, in essence, a diffractive
lens. The process, which is generally for feature sizes greater than 2um, is somewhat
removed from traditional proximity lithography.
A diagram Dr. Hennemeyer talked around is reproduced here as figure 3. It compares the DOF of a traditional mask used to make a hole versus an FZP.
reference to the above diagram, in the top left we have a round hole in a mask.
To the right, we have a prediction of the light intensity when projected
through the mask. The DOF is relatively close to the mask. Below that, on the
left, we have an FZP mask. The pattern is larger and more complex, requiring
polarity changes in the rings, but the DOF is greater (and further away from
Dr. Hennemeyer held the floor to give a follow-on presentation about improving proximity imaging quality using diffractive elements. A key point made concerned the use of optical proximity correction (OPC) and the inclusion of features on the source mask that are not meant to be printed. Rather they are present to ‘influence’ the shape that will be printed. For example, the rounding effect means that a square in the mask might produce something closer to a circle. However, the presence of features (smaller squares) to ‘re-enforce’ the corners can result in the printing of a much better square; subject to the size of the smaller squares and their distance from the main square on the mask. See figure 4.
on mask aligners is more challenging than on steppers. Simulation provides
considerable benefits though according to Dr. Hennemeyer, who went on to
recount the developments of a joint SUSS/GenISys project. Findings to date
reveal that light source stability and reliable gap settings are key to
implementing OPC, which helps in the creation of ‘sharper’ features and steep
SUSS MicroTec kept the floor for the next presentation, as Christof Kronseder gave an overview of UV LED light sources and recounted a number of developments that have taken place during recent years. The advantages of LED over traditional mercury lamps include lower running costs (during use and by virtue of not requiring a warm-up) and reduced cooling requirements. Kronseder recounted that SUSS began its LED journey with an alternative for 350W mercury lamps and is currently working on a 1kW system.
This session was themed ‘Imprint / Applications’ and began with a presentation from Dr. Simon Drieschner, an Applications Engineer with SUSS MicroTec, on solutions for micro and nano imprinting, using substrate conformal imprint lithography (SCIL) and SUSS’s proprietary SUSS MicroTec imprint lithography equipment (SMILE) respectively (see figure 5).
The presentation included a comparison of stamp materials from a total-cost-of-ownership perspective and factored in curing times, which are often overlooked but essential for volume manufacturing scenarios as they can vary from circa 15 minutes to more than three days. Two main materials were compared, epoxides (which are proven in the field) and hybrid acrylates (which are a relatively new development but watch this space as the benefits are considerable). See figure 6.
concluded with a report from academia, in the form of a presentation from
Swansea University, given by Dominic Chung Man Fung and which provided an
example of the SCIL process as part of an Innovate UK funded project.
was to develop a low cost, volume fabrication process for a wafer scale
distributed feedback (DFB) laser. Challenges included feature size and shape
(plus achieving steep sidewall angles), stamp [soft master] curing time, the
hard master having an anti-stick layer (ASL) and, of course, attaining high
results have been achieved so far on 3” wafers. For instance, an ASL for the
hard master has been created using FDTS (a.k.a. Perfluorodecyltrichlorosilane –
an anti-sticking process used in other technology fields) and soft stamps are
exhibiting high reproducibility. The most impressive achievement however is how
rapidly high yield has been attained – see figure 7.
Future goals include attaining 100% yield (far from unachievable considering the results to date), scaling to 4”, 6” and 8” wafers and performing studies into the lifetime of the soft master.
inaugural UK Lithography Conference concluded with a note of thanks from Matt
Brown of Inseto, the organiser of the event. Thanks went to Rutherford Appleton
Laboratory for hosting the conference, to SUSS MicroTec for their sponsorship
and to the speakers (most of whom had travelled in from outside the UK).
To repeat a
few words from the intro of this report, the event was a resounding
success. The lithography community is facing (and as the conference proved, is
solving) a whole host of technical challenges amidst a backdrop of commercial
Productivity and efficiency are being realised through developments in tools and methodologies and, through networking events like the conference, ideas are being shared and further developed – which is all great news for this exciting industry.
Inseto supplies STFC with a semi-automated mask aligner to advance its in-house manufacturing capabilities and enhance the services offered to SMEs and start-ups.
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has supplied the Science and Technology Facilities Council (STFC) with a SUSS MicroTec MA8Gen4Pro mask aligner for the lithography of semiconductor wafers.
STFC’s investment in the mask aligner was made for two reasons. Firstly, it is being used by STFC’s Interconnect Group, which designs and manufactures advanced packaging solutions for semiconductor die needed for scientific instruments. The MA8Gen4Pro will soon be used for the placement of millions of 20μ diameter bumps on a 50μ pitch onto a wafer containing more than 100 die; with each die set to measure just 196mm2 and to 65,000 bumps.
Secondly, the MA8Gen4Pro has become the latest piece of equipment STFC’s Innovations Technology Access
Centre (I-TAC) makes available to start-ups under an innovative service to incubate SMEs. I-TAC has nearly
100 companies and groups leasing their facilities for projects ranging from sensors for gas turbines, lab on
chip and devices for head-up displays.
Matt Brown, Director of Inseto, concludes: “We’re delighted that the SUSS MicroTek equipment is playing a vital role in the manufacture of the chips for the STFC’s particle physics experiments and that I-TAC’s customers will have access to the latest generation aligner for their development and manufacturing purposes.”
Inseto and DELO celebrate 20 years of partnership.
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, and DELO, a
leading manufacturer of industrial adhesives, are celebrating 20 years of partnership during which meeting
customers’ needs has, and remains, an unwavering top-priority.
Inseto is DELO’s exclusive distributor in the UK and Ireland and has extensive experience of supporting
customers in high-tech engineering sectors – including electronics and microelectronics – and harsh
environment industries including aerospace, automotive and oil & gas.
Robert Saller, Managing Director of DELO, comments: “Since their appointment in 1998, Inseto has always
impressed us with their knowledge of adhesives and the way in which they work tirelessly with customers to
find fit-for-purpose solutions.”
In addition to advising customers on which standard products will best meet their requirements, Inseto has
worked with DELO’s R&D chemists during the development of new adhesives needed for custom
applications. One such example of this collaborative process resulted in the development and launch of a
light-activated adhesive and process; in that the components being bonded were non-transparent, so the
light-curing had to be ‘triggered’ at a critical build stage.
Other success stories, and there are many, include the provision of adhesives for: the bonding of positional
sensors in power assisted steering modules using a pre-activated cationic epoxy; the mechanical protection
of large components in high-vibration environments using a light-cured epoxy; the encapsulation of
electronic components in single-use medical instruments using a two-part Polyurethane; and the protection
of silicon die and wire bonds in multiple microelectronic applications.
Eamonn Redmond, Sales Manager of Inseto, comments: “It’s a privilege to be working with DELO, as the
company has a very healthy attitude to R&D, and as the industry presents new bonding challenges, the
company is quick to respond with not just new chemistries for adhesives but also the processes required to
meet customers’ needs.”
Redmond’s observation is borne out by the fact that more than 40% of DELO’s revenue during its most recent
financial year, came from adhesives developed in the last three years; proof-positive that the company is
responding to industry’s emerging needs. Recent ground-breaking technologies include: dual-curing
adhesives for use in multiple applications; low-temperature curing adhesives for temperature-sensitive
substrates; and high temperature-resistant epoxies for the most demanding of applications.
Saller concludes: “Inseto has played a crucial role in strengthening our footprint in the UK and Ireland during
the last 20 years and we’re very much looking forward to continuing the partnership.”
For information on DELO’s products, available through Inseto’s Adhesives Division, please visit
Inseto appointed to represent SUSS MicroTec in Finland, Norway and Sweden.
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials to the
microelectronic research and manufacturing sectors, has been appointed to represent semiconductor
manufacturing equipment OEM SUSS MicroTec in Finland, Norway and Sweden.
Under the arrangement, Inseto’s Equipment Division will be responsible for the regional sales of mask and
wafer aligners, spin coaters, wafer bonders and other equipment from SUSS MicroTec’s product range.
Virginie Quet, SUSS MicroTec’s Director of Sales and Marketing in Europe, the Middle East and Africa,
comments: “Inseto has been representing our product lines in the UK and Ireland for a little over a year and
we are extremely impressed with their knowledge of the semiconductor industry.”
Inseto’s experts have received formal training from SUSS MicroTec on the use of its equipment. This
knowledge, when combined with Inseto’s complementary equipment portfolio and ability to supply wafers
and other materials, means the company can provide a comprehensive sales service; one that best supports
customers’ overall programme goals.
Jim Rhodes, Technical Sales – Nordic, of Inseto, comments. “We know the territories extremely well as we’ve
been representing other OEMs and their product lines in Finland, Norway and Sweden for almost 10 years
now, and we have well-established relationships with customers already using, or who could benefit from
using, SUSS MicroTec’s semiconductor manufacturing equipment.”
Quet concludes: “At SUSS, we choose our partners very carefully and, in Inseto, we feel there’s potential for
an enduring partnership that will benefit our highly valued customers in Finland, Norway and Sweden.”
For space and other harsh environment applications, high reliability packaging is a must to
protect electronic circuitry. Richard Warrilow talks to Optocap and Inseto about how an
infra-red reflow system is helping ensure seal integrity.
Established in 2003 and part of the Alter Technology Group, Optocap is a packaging service provider,
active in the fields of optoelectronics, microelectronics and MEMS. Its services include the design
and manufacture of packages, circuitry encapsulation and package test; enabling its customers to
focus on their circuitry design tasks, reduce their overall development and manufacturing costs,
reduce risks during the packaging stages and accelerate time to market. In addition, the company
supports start-ups and university spin-offs.
Optocap’s customers include space agencies, satellite manufacturers, and aerospace and defence
companies, all of which have requirements for electronics to operate in harsh environments.
To ensure reliability at a component level – and by extension the system level – electronic devices
must be manufactured and sealed to very high standards. Solder oxides must be reduced as much as
possible before and during solder reflow to minimise voids in solder joints. Also, components must
be hermetically sealed within a controlled environment to minimise moisture content.
For space applications, the package will typically be back-filled with nitrogen or vacuum sealed.
Doing so keeps the inner circuitry and bonds free from corrosion. Specifically, moisture levels
greater than 5000ppmv within the package can lead to component failure, with catastrophic results
at the system level. The 5000ppmv limit is specified so that, in theory, any moisture present within
the package will not condense until below freezing conditions; at which point it would form ice
crystals that are unable to start the corrosion process. Moreover, some sensors, such as MEMS
gyros, must be vacuum sealed to produce repeatable results.
“Most customers come to us with one or more die they need to have attached onto a substrate,
then sealed into a package,” comments Stephen Robertson, Engineering Manager of Optocap. “We
then design the substrate, source or design a package, assemble the components and seal the
package to protect from the outside environment. To confirm the package is sealed, we then leak-
test the device. We can also perform a few basic electrical tests here at Optocap but our parent
company, Alter Technology, can develop custom and bespoke test platforms, depending on the
product and application.”
Robertson goes on to explain that the company tends not to focus on high volume products. Instead,
Optocap’s services are tailored for low- to mid-volume projects – ranging from just a few devices up
to several thousand devices per month – that require a varied mix of often high complexity devices.
Turnaround times are typically about three months but, depending on the device complexity, can be
over a year. Conversely, for less complex devices, Optocap offers a next-day service. However,
irrespective of project duration, heavy reliance is placed on the company’s manufacturing and test
equipment to ensure seal integrity.
Go with the flow
When Optocap became part of the Alter Technology Group, in 2016, the demand for hermetic solder
sealed packages increased. However, the company could not accommodate such projects as, at the
time, its vacuum solder reflow oven had a limited temperature range. This prevented its use for
gold-tin soldering, the most common approach to hermetic solder sealing. The oven was also limited
to using only nitrogen as a cover gas.
In early 2017, Optocap invested in an ATV SRO-716 infrared (IR) reflow oven, supplied through ATV’s
representative in the UK and Ireland, Inseto. John Govier, a Director of Inseto, comments: “Because
of its good process stability and high repeatability, the ATV SRO-716 is a very popular oven in
semiconductor, microelectronics and MEMs manufacturing.”
For a process run, a profile (see figure 1) is created in software residing on the ATV SRO-716. The
profile controls temperature ramp-ups, hold durations and ramp-downs. It is also used to signal
Mass Flow Controllers (MFCs) to release gas into the oven (which may be nitrogen for cooling
purposes) or pumps to create a vacuum. The profile also controls the flow of chemicals into the
oven. For instance, formic acid is introduced at a low temperature to remove oxides.
“We’ve developed our control profiles over several years,” comments Robertson. “As you’d expect,
there are trade-offs to make such as steep temperature ramp rates versus the risk of thermo-
Robertson goes on to explain some of the jigs in which the devices are placed have large thermal
masses, and temperature differences of between 10 and 15 degrees C frequently occur. Helping the
process is the use of thermocouples – an integral part of the ATV SRO-716 – which provide an
indication of the temperature inside the jig. These thermocouples, along with pressure sensors, form
part of a closed-loop system controlled by the profile.
Though a profile may contain dozens of steps, these tend to be just a few minutes long and a typical
gold-tin solder profile is about 45 minutes. Govier notes: “The ATV SRO-716 is a reliable, accurate
and repeatable piece of equipment, and as part of our service we ensure full training is given to
bring users up to speed on how to get the best from the oven.”
Robertson concludes: “We’re operating the oven at temperatures of up to 400oC, whereas before
250oC was the limit. This means we can use gold-tin solder, which is now the de facto material for
solder lid seal within the microelectronics sector. We’re getting better results than before, based on
the reduced level of voiding observed on products previously qualified on the older vacuum oven, so
we’re using the ATV SRO-716 for lower temperature work too. Also, the new oven gives us control
over chemicals and gases that we’ve not had before, enabling us to take on a variety of new
Inseto expands its Semiconductor sector products and services with its acquisition of
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials to the
microelectronic research and manufacturing sectors, has acquired IDB Technologies, a specialist supplier of
semiconductor wafers and substrates. The two companies have worked closely together for several years and
share many of the same customers, who now stand to benefit greatly from the combined resources and
Matt Brown, Director, comments: “IDB Technologies worked primarily with universities in the UK and
mainland Europe. Many spin-off companies have emerged from these universities and are now scaling for
volume production, which is where Inseto can help.”
IDB Technologies’ materials stock and service offerings have added to Inseto’s Consumables Division, which
already represents 12 OEMs, including semiconductor assembly materials and machine consumable tooling.
In addition, Ian Burnett, founder of IDB Technologies, has joined Inseto to provide support to customers.
Burnett comments: “This is a win-win for all parties concerned, and especially our customers. Inseto is ISO
9001:2015 certified, has invested in an impressive storage and handling facility and has automated many of
its processes to assure as fast a turnaround as possible on all orders.”
Inseto can now supply a wide range of wafers, with next day delivery, from an extensive UK stock, and many
other wafers can be provided on short lead-times. The company also processes wafers including oxidised and
nitride coating, patterned and diced wafers.
Matt Brown, a Director of Inseto, comments: “As users’ projects become more complex, and as they scale
their manufacturing processes to serve their target markets, it is essential to have a streamlined supply chain
plus the ability to call on technical expertise when it comes to specifying materials and equipment. Following
our acquisition of IDB Technologies, and along with Ian coming on board, Inseto can help users commercialise
their products by de-risking manufacturing aspects they are perhaps encountering for the first time.”
Inseto is a Gold Sponsor of the forthcoming IMAPS-UK Annual Conference “MicroTech”, which is celebrating
50 years since the foundation of the Society (www.imaps.org.uk) on 10th April 2018.
Inseto has acquired IDB Technologies, and now stocks and supplies semiconductor wafers (of varying
types) typically with next day delivery.
High temperature adhesive DELO® MONOPOX HT760 now available in the UK and Ireland
Andover, United Kingdom – Inseto, a leading technical distributor of equipment and materials, has added
DELO® MONOPOX HT760 to its extensive range of products from DELO Industrial Adhesives. Ideal for a variety
of automotive, aerospace and oil & gas sector applications, DELO® MONOPOX HT760 is a high temperature,
heat-cured anhydride adhesive. It boasts a high bond strength after long-term aging (1,000 hours at 250oC) and
at temperature (also 250oC), as well as having good temperature stability and thermal and chemical resistance.
Eamonn Redmond, Sales Manager, comments: “Many applications now require adhesives that can survive high
temperatures and still bond well. In the oil & gas sector, for example, product extraction temperatures can be
over 200oC. And in the automotive sector, several fluids are used which can compromise bond integrity.”
In tests, DELO® MONOPOX HT760 demonstrated a bond strength (compression shear strength on ceramics) of
43MPa when tested at room temperature. After 500 hours at 250oC, cooling and subsequent increases in
temperature the test results were: 52MPa at room temperature, 15MPa at 200oC, 12MPa at 220oC and almost
10MPa at 250oC. Also, in compression shear strength tests – FR4 on FR4 after 20 minute of curing at 150oC,
subsequent cooling and exposure to typical automotive fluids – the following results were produced: 47MPa
for diesel, 44MPa for petrol and 43MPa for ATF gear oil.
Unlike most specialist adhesives for harsh environment industrial applications, DELO® MONOPOX HT760 can be ordered in minimum order quantities as low as 200g; supplied as four 50g syringes. Redmond notes: “All adhesives have a finite shelf life so ordering large quantities can prove wasteful in the long-run.
At Inseto, our philosophy is one of Total Customer Service, and we are committed to working with all customers to understand their processes and supply them with made-to-order adhesives in suitable quantities and at optimum intervals. Also, our relationship with DELO is such that we frequently get involved in specifying changes to the chemistry of some adhesives for bespoke applications.”
Inseto is DELO Industrial Adhesives’ exclusive distributor in the UK and Ireland. Products available through Inseto include an extensive range of UV cured or light activated epoxies, light cured acrylates, light / heat cured epoxies, dual curing materials, light / anaerobic curing adhesives, 2 part polyurethanes, 1 & 2 part epoxies, cyanoacrylates and single part silicones.
For further information on these products please visit https://www.inseto.co.uk/adhesives.php.