Consumables

Inseto’s Consumable Division provides assembly materials and machine consumable tooling for the Semiconductor, Microelectronic, Electronic, Photonic, RF and Hybrid assembly industries etc.

Products & services include: semiconductor & silica wafers, sub-contract wafer bumping & dicing, die attach adhesives and glob-top materials, bonding wires & ribbons, plated wire & ribbons, precision metal stampings, solder spheres & solder preforms, hermetic glass & ceramic semiconductor packages, thick film pastes and glazes, metallised thin film substrates, thermal dissipation materials, plus machine consumable tooling, including dicing blades, die attach pick-up tips and collets, wire bonding wedges and capillaries, welding electrodes and hot-bar thermodes etc.