Consumables
Inseto’s Consumable Division provides assembly materials and machine consumable tooling for the Semiconductor, Microelectronic, Electronic, Photonic, RF and Hybrid assembly industries etc.
Products & services include: semiconductor & silica wafers, sub-contract wafer bumping & dicing, bonding wires & ribbons, plated wire & ribbons, precision stampings, solder spheres & preforms , hermetic glass & ceramic packages, thick film materials, metalised thin film substrates, thermal dissipation materials, welding electrodes & thermodes, plus bonding wedges, capillaries, die collets & dicing blades etc.include gold, aluminium, copper and silver bonding wires and bonding ribbons, precision metal stampings, solder preforms, hermetic glass & ceramic sealed packages, thick film materials (thick film inks), metallised thin film and precision machined ceramics, thermal dissipation materials, welding electrodes and thermodes and die / wire bond assembly consumables including wedges, capillaries and collets, dicing blades etc.

Semiconductor Wafers and Substrates

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Hubless Annular Dicing Blades

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Hubbed Dicing Blades

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Thin Film Metalised Substrates

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Thick Film Materials

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Solder Preforms & Ribbon and Metal Stampings

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Die Attach Adhesives and Encapsulants

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Bonding Wire and Ribbon

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Bonding Capillaries

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Wire Bonding Wedges and Die Attach Tooling

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Welding Electrodes and Hot Bar Thermodes

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Thermal Management Materials

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Hermetic Ceramic and Metal Packages

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Package Cover Assemblies

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Ex-Stock Semiconductor Packages

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Further Information
Technical Downloads
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Inseto Product Presentation Overview
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