Adhesives for Microelectronic Assembly
DELO adhesives are used in a vast range of microelectronic assembly applications including die attach, IC encapsulation including Dam & Fill, plus light-activated and light-cured adhesives for casting, sealing and joining.
As well as traditional die attach adhesives such as conductive & non-conductive epoxies, DELO has developed a dual-curing silver epoxy that cures by a combination of UV & heat, or just by heat alone. UV-curing the fillet around the die immediately after component placement guarantees that movement of the die during heat cure in eliminated. This results in improved placement accuracy at repeatable levels. It can also enable off-line heat curing, thereby saving costly in-line processing time.
More detailed application examples of adhesives for microelectronic assembly, including materials for MEMS applications and for large or small die encapsulation, are shown HERE. However if your particular requirement is not listed, please contact us for further information, as it is more than likely that a similar requirement has been solved before.
Die Attach Adhesives
Delo’s high-purity, low CTE die attach adhesives, including conductive and non-conductive materials.
Glob-top adhesives for protecting bare silicon die. Adhesives for small area protection, plus dam and fill versions for larger die.
See the DELO product range for all applications.
Tel: +44 (0)1264 334505
Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Protection Against Vibration, Conductive Electrical Connection, Dam & Fill
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
Available from Inseto in the United Kingdom & Ireland