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Inseto

Die Attach Adhesives

Die Attach Adhesives Key Features

  • High purity adhesives optimised for mimimum outgassing
  • Cure options include fast curing in seconds
  • Light-fixing capability significantly reduces process times
  • Added benefit of precise placement accuracy – elimination of movement during heat-cure
  • Increased temperature stability, up to 250°C, in some instances
  • Very low cure temperature of 60°C also available
  • Electrically & thermally conductive and non-conductive options

Reliability is paramount in microelectronic applications, whether the end-product is for a military or commercial application. DELO’s high-purity, low CTE adhesives provide the perfect combination for use in all applications. With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, etc.) and an extended working life, DELO’s conductive and insulating adhesives meet all customer requirements.

Die attach adhesives are used in widely differing applications – semiconductor assembly onto leadframes, hybrid assembly onto alumina, commercial FR4 applications, etc – and therefore must meet a wide range of specifications.

DELO has developed products specifically designed for such applications, featuring:

  • A wide product range for a variety of substrates
  • High throughout due to reduced cycle times and innovative processes such as light-fixing
  • Reduced costs as a result of extended processing times
  • High temperature stability up to 250°C allowing for lead-free assembly
  • Low humidity sensitivity with < 0.3% water absorption
  • High purity with < 10ppm ionic impurities

New developments include dual-curing adhesives that allow very fast fixing of the components by illuminating the adhesive fillet with UV light, and subsequent curing of the adhesive under the component by the application of heat, whether at wire-bonding, over-moulding, or encapsulation.

With an increasing number of temperature-sensitive substrates being used in electronic applications, DELO has developed a range of adhesives that use a low-temperature chemistry, curing at 60°C.

Die Attach Adhesives Product Range

Product

Viscosity

Description

Product

AC245

Viscosity

33,000

Description

Anisotropic (Z-axis) Conductive Epoxy for flip-chip / BGA bonding, one-part, heat-cured, fast curing (6s) by thermode, nickel-filled (d50 < 5.3µm), low ionic impurities, excellent adhesion to FR4 & PET

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Product

AC265

Viscosity

26,000

Description

Anisotropic Conductive Epoxy for flip-chip / BGA bonding, one-part, heat-cured, fast curing (6s) by thermode, gold-over-nickel polymer balls (d50 < 2.5µm), low ionic impurities, excellent adhesion to FR4 & PET

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Product

AC268

Viscosity

28,000

Description

Anisotropic Conductive Epoxy for flip-chip / BGA bonding, one-part, heat-cured, fast curing (6s) by thermode, nickel-filled (d50 < 5.3µm), low ionic impurities, excellent adhesion to FR4 & PET

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Product

AD340

Viscosity

12,000

Description

Non-conductive die-attach epoxy, one-part, UV & heat-cured for very high placement accuracy, fast curing, suitable for bonding to leadframes, FR4 & flex circuits, dispensing only

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Product

AD761

Viscosity

11,000

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing, highly flexible for larger die

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Product

BS3770

Viscosity

115,000

Description

B-Stageable epoxy, one-part, light-fixable & heat-cured (150°C recommended), suitable for die attach and lid sealing, screen- & stencil printable, highly flexible with very low Tg (-57°C)

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Product

DA255

Viscosity

33,000

Description

Non-conductive die-attach epoxy, one-part, heat-cured (90°C minimum), fast curing, suitable for bonding to leadframes, FR4 & ceramic substrates, low ionic impurities

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Product

DA587

Viscosity

31,000 thix

Description

Non-conductive die-attach epoxy, one-part, heat-cured (120°C minimum), fast curing, suitable for bonding to leadframes, FR4 & epoxy tape, low ionic impurities

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Product

DA588

Viscosity

31,000 thix

Description

Non-conductive die-attach epoxy, one-part, heat-cured (120°C minimum), fast curing, suitable for bonding to leadframes, FR4 & epoxy tape, low ionic impurities

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Product

IC343

Viscosity

42,000 thix

Description

Conductive die-attach epoxy, one-part, UV & heat-cured for very high placement accuracy, fast curing, suitable for bonding to FR4 & flex circuits, dispensing only

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Product

LT204

Viscosity

28,000

Description

Low temperature cured (60°C minimum) non-conductive die-attach epoxy, one-part, suitable for bonding to temperature-sensitive substrates, complies with NASA outgassing requirements

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Product

MK096

Viscosity

Pasty

Description

Non-conductive component-attach epoxy, one-part, heat-cured, fast curing, suitable for bonding to FR4 & plastic substrates, low ionic impurities

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Product

OB749

Viscosity

14,000

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing, complies with NASA outgassing requirements

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Product

OB786

Viscosity

32,000 thix

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing

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Product

OB787

Viscosity

150,000 thix

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing, fluorescent for in-line inspection purposes

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Product

OB793

Viscosity

125,000 thix

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing

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Product

TC2270

Viscosity

140,000

Description

Thermally conductive die attach epoxy, one-part, heat-cured (60°C minimum), low CTE, operating temperature range of -40°C – 150°C

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Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Bonding, Glob-Top, Encapsulation, Dam & Fill, Z-Axis Bonding, Sealing, Potting, Protection Against Vibration, Conductive Electrical Connection

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.

Region

Available from Inseto in the United Kingdom & Ireland

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