Die Attach Adhesive

Reliability is paramount for die attach in microelectronic applications, whether the end-product is for a military or commercial application. DELO’s high-purity, low CTE epoxy die attach adhesive range provides the perfect combination for use in all applications.

With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, etc.) and an extended working life, DELO’s conductive and non-conductive die bonding adhesives meet an extensive range of customer requirements and specifications.

The adhesives are used in widely differing die bond applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.

DELO has developed products specifically designed for such applications, featuring:

• A wide die attach adhesive product range for a variety of substrates
• High throughout due to reduced cycle times and innovative processes such as light-fixing
• Reduced costs as a result of extended processing times
• High temperature stability up to 250°C allowing for lead-free assembly
• Low humidity sensitivity with < 0.3% water absorption
• High purity with < 10ppm ionic impurities

New developments include dual-curing die attach adhesives that allow very fast fixing of the components by illuminating the adhesive fillet with UV light, and subsequent curing of the adhesive under the component by the application of heat, whether at wire-bonding, over-moulding, or encapsulation.

With an increasing number of temperature-sensitive substrates being used in electronic applications, DELO has also developed a range of adhesives that use a low-temperature chemistry, curing at 60°C.

To see details of example applications using DELO die attach adhesives, please click HERE.