Inseto
Inseto

Die Attach Adhesive

Die Attach Adhesive Key Features:

  • High purity adhesives optimised for mimimum outgassing
  • Cure options include fast curing in seconds
  • Light-fixing capability significantly reduces process times
  • Added benefit of precise placement accuracy – elimination of movement during heat-cure
  • Increased temperature stability, up to 250°C, in some instances
  • Very low cure temperature of 60°C also available
  • Electrically & thermally conductive and non-conductive options

Reliability is paramount for die attach in microelectronic applications, whether the end-product is for a military or commercial application. DELO’s high-purity, low CTE epoxy die attach adhesive range provides the perfect combination for use in all applications.

With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, etc.) and an extended working life, DELO’s conductive and non-conductive die bonding adhesives meet an extensive range of customer requirements and specifications.

The adhesives are used in widely differing die bond applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.

DELO has developed products specifically designed for such applications, featuring:

  • A wide die attach adhesive product range for a variety of substrates
  • High throughout due to reduced cycle times and innovative processes such as light-fixing
  • Reduced costs as a result of extended processing times
  • High temperature stability up to 250°C allowing for lead-free assembly
  • Low humidity sensitivity with < 0.3% water absorption
  • High purity with < 10ppm ionic impurities

New developments include dual-curing die attach adhesives that allow very fast fixing of the components by illuminating the adhesive fillet with UV light, and subsequent curing of the adhesive under the component by the application of heat, whether at wire-bonding, over-moulding, or encapsulation.

With an increasing number of temperature-sensitive substrates being used in electronic applications, DELO has also developed a range of adhesives that use a low-temperature chemistry, curing at 60°C.

To see details of example applications using DELO die attach adhesives, please click HERE.

Example Applications

Die Attach Adhesive Product Range

Product

Viscosity

Description

Product

AC265

Viscosity

26,000

Description

Anisotropic Conductive Epoxy for flip-chip / BGA bonding, one-part, heat-cured, fast curing (6s) by thermode, gold-over-nickel polymer balls (d50 < 2.5µm), low ionic impurities, excellent adhesion to FR4 & PET

Download

Product

AC268

Viscosity

28,000

Description

Anisotropic Conductive Epoxy for flip-chip / BGA bonding, one-part, heat-cured, fast curing (6s) by thermode, nickel-filled (d50 < 5µm), low ionic impurities, excellent adhesion to FR4 & PET

Download

Product

AC6530

Viscosity

20,000

Description

Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 < 5µm), fast curing (1s) by thermode, excellent adhesion to FR4 & PET

Download

Product

AC6545

Viscosity

42,500

Description

Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 = 5µm), fast curing (1s) by thermode, excellent adhesion to FR4 & PET

Download

Product

AD340

Viscosity

15,600

Description

Non-conductive die-attach epoxy, one-part, UV & heat-cured for very high placement accuracy, fast curing, suitable for bonding to leadframes, FR4 & flex circuits, dispensing only

Download

Product

AD761

Viscosity

6,000

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing, highly flexible for larger die

Download

Product

BS3770

Viscosity

115,000

Description

B-Stageable epoxy, one-part, light-fixable & heat-cured (150°C recommended), suitable for die attach and lid sealing, screen- & stencil printable, highly flexible with very low Tg (-57°C)

Download

Product

DA255

Viscosity

33,000

Description

Non-conductive die-attach epoxy, one-part, heat-cured (120°C minimum), fast curing, suitable for bonding to leadframes, FR4 & ceramic substrates, low ionic impurities

Download

Product

DA587

Viscosity

31,000 thix

Description

Non-conductive die-attach epoxy, one-part, heat-cured (130°C minimum), fast curing, suitable for bonding to leadframes, FR4 & epoxy tape, low ionic impurities

Download

Product

DA588

Viscosity

31,000 thix

Description

Non-conductive die-attach epoxy, one-part, heat-cured (130°C minimum), fast curing, suitable for bonding to leadframes, FR4 & epoxy tape, low ionic impurities

Download

Product

IC343

Viscosity

42,000 thix

Description

Conductive die-attach epoxy, one-part, UV & heat-cured for very high placement accuracy, fast curing, suitable for bonding to FR4 & flex circuits, dispensing only

Download

Product

LT354

Viscosity

145,000 thix

Description

Light & heat-cured mCD epoxy, grey, low-temperature (80°C) heat curing for shadow zones, particle size of d95 = 21µm

Download

Product

OB749

Viscosity

14,000

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing, complies with NASA outgassing requirements

Download

Product

OB786

Viscosity

32,000 thix

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing

Download

Product

OB787

Viscosity

46,800 thix

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing, fluorescent for in-line inspection purposes

Download

Product

OB793

Viscosity

125,000 thix

Description

Non-conductive die attach epoxy, one-part, UV and / or heat-cured for very high placement accuracy, fast curing

Download

Product

TC2270

Viscosity

140,000 thix

Description

Thermally conductive die attach epoxy, one-part, heat-cured (60°C minimum), low CTE, operating temperature range of -40°C – 150°C

Download

Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Bonding, Glob-Top, Encapsulation, Dam & Fill, Z-Axis Bonding, Sealing, Potting, Protection Against Vibration, Conductive Electrical Connection

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.

Region

Available from Inseto in the United Kingdom & Ireland

Request Form