Inseto
Inseto

Encapsulation Adhesives

Encapsulation Adhesives Key Features

  • High purity adhesives for bare die encapsulation
  • Low CTE to prevent substrate warpage and breaking of wirebonds
  • High Tg to minimise stresses, both during and after cure
  • Excellent protection against mechanical stresses (temperature, vibration, etc.)
  • Very high chemical resistance, e.g. automotive fluids, printing inks, etc.
  • Option of heat-cured or UV-cured product ranges

Protecting bare silicon die is done in a variety of ways, by overmoulding in traditional semiconductor packaging, in metal hermetic packages, or by encapsulation on organic substrates.

Depending on the die size, either a single-stage globtop is used or, for larger die, a two-stage process of damming the die with a high-viscosity adhesive and filling the enclosed space with a low-viscosity compatible adhesive.

For useful information on choosing the right encapsulation adhesive, help in understanding the terminology, and processing and technical guidelines, please look at our Knowledge Base Fact Sheet here.

DELO’s family of heat-cured anhydride-curing epoxies offer significant advantages to the user:

  • Dam heights of 3mm and above
  • Simultaneous curing of Dam and Fill
  • Fast curing times of 20 minutes at 150°C
  • Optional low-temperature cure temperature at 100°C
  • Operating temperature range from -65°C to +180°C
  • Low CTE’s of < 25ppm for thermal mis-match compensation
  • High Tg’s of approx. 180°C, with decomposition temperatures in excess of 320°C
  • Excellent chemical and media resistance
  • Compliance with JEDEC MSL 1 requirements
  • Thermal shock resistance of > 1,000 cycles from -40°C to +150°C
  • High purity with < 10ppm ionic impurities
  • Low humidity sensitivity with < 0.1% water absorption

In addition, DELO offers UV-cured epoxies for:

  • Very fast curing (seconds)
  • Short cycle times = high volume assembly
  • Simultaneous curing of Dam & Fill
  • Operating temperature range from -40°C to +150°C
  • Excellent chemical and media resistance
  • High purity with < 10ppm of Na+, K+, Cl ions

Encapsulation & GlobTop Adhesive Product Range

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Protection Against Vibration, Conductive Electrical Connection, Dam & Fill

Industry Segments

Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.

Region

Available from Inseto in the United Kingdom & Ireland

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