Bonding Capillaries & Dicing Blades by Kulicke & Soffa

Kulicke and Soffa (K&S) is the world’s leading manufacturer of advanced bonding capillaries for a broad range of applications from standard to ultra-fine pitch copper and gold wires, designed to suit all major brands of wire bonding equipment.

K&S also develops and manufactures a full range of hubbed dicing blades (formerly known as Semitec) for wafer dicing and cutting a wide variety of advanced materials and packages. Nearly three decades of experience in sophisticated blade technology have shown that meeting the desired objectives for cut quality, throughput and blade life requires matching the material to be cut with the appropriate blade composition and geometry.

K&S - Kulicke and Soffa

Further Information

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Tel: +44 (0)1264 334505



Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Wire Bonding Gold Wire, Ball Bonding Copper Wire, Flip Chip Bump Bonding, Stud Bumps

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Kulicke & Soffa Website


Available from Inseto in the United Kingdom, Ireland & Nordic Region

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