Bonding Capillaries & Dicing Blades by Kulicke & Soffa
Kulicke and Soffa (K&S) is the world’s leading manufacturer of advanced bonding capillaries for a broad range of applications from standard to ultra-fine pitch copper and gold wires, designed to suit all major brands of wire bonding equipment.
K&S also offers a develops and manufactures a full range of hubbed dicing blades (formerly known as Semitec) for wafer dicing and cutting a wide variety of advanced materials and packages. Nearly three decades of experience in sophisticated blade technology have shown that meeting the desired objectives for cut quality, throughput and blade life requires matching the material to be cut with the appropriate blade composition and geometry.
An extensive range of capillaries for Au, Ag & Cu wires, for ball bonding and bumping applications.
Wafer Dicing Blades
Full range of hub dicing blades for a variety of advanced material applications.
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Wire Bonding Gold Wire, Ball Bonding Copper Wire, Flip Chip Bump Bonding, Stud Bumps
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Kulicke & Soffa Website
Available from Inseto in the United Kingdom, Ireland & Nordic Region