Wire Bond Capillary

Wire Bonding Capillary Key Features:

  • Capillaries for gold ball bonding and bumping applications
  • Specific capillaries for copper and silver wires
  • Standard and fine pitch capillary designs
  • Suitable for all OEM manual and automated ball bonders
  • For current and legacy equipment
  • Many designs available ex-stock

Kulicke and Soffa (K&S) is the world’s leading manufacturer of advanced wire bond capillary tools for a broad range of applications from standard to ultra-fine pitch bonding of copper and gold wires, through capillary designs suitable for wafer level bump bond and capillaries suitable for manual ball bonding equipment.

K&S produce an extensive range of capillaries for Au & Cu wire, from large pitch (120 µm pad pitch) through ultra-fine pitch (35µm and below) applications. K&S capillaries are continuously developed to improve bond process reliability, equipment performance, looping characteristics, longevity and yield.

With over 40 years experiences, in providing end-to-end solutions to a wide array of customers applications, KnS provide wire bond capillaries to suit all major brands of equipment.

For information on common features and selection criteria for ball bond capillaries, please look at our Knowledge Base Fact Sheet here.

Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505



Wire Bonding Gold Wire, Ball Bonding Copper Wire, Flip Chip Bump Bonding, Stud Bumps, Wafer Level Bump Bonding

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Kulicke & Soffa Website


Available from Inseto in the United Kingdom, Ireland & Nordic Region

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