Wire Bond Capillary
Capillaries Key Features:
- Capillary for gold ball bonding and bumping applications
- Specific capillaries for copper and silver wires
- Standard and fine pitch capillary designs
- Suitable for all OEM manual and automated ball bonders
- For current and legacy equipment
- Many designs available ex-stock
Kulicke and Soffa (K&S) is the world’s leading manufacturer of advanced wire bonding capillary tools for a broad range of applications from standard to ultra-fine pitch bonding of copper and gold wires, through capillary designs suitable for wafer level bump bond and capillaries suitable for manual ball bonding equipment.
K&S produce an extensive range of capillaries for Au & Cu wire, from large pitch (120 µm pad pitch) through ultra-fine pitch (35µm and below) applications. K&S capillaries are continuously developed to improve bond process reliability, equipment performance, looping characteristics, longevity and yield.
With over 40 years experiences, in providing end-to-end solutions to a wide array of customers applications, KnS provide wire bond capillaries to suit all major brands of equipment.
Tel: +44 (0)1264 334505
Wire Bonding Gold Wire, Ball Bonding Copper Wire, Flip Chip Bump Bonding, Stud Bumps, Wafer Level Bump Bonding
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Kulicke & Soffa Website
Available from Inseto in the United Kingdom, Ireland & Nordic Region