Bonding Wire & Ribbon, Precision Metal Stampings & Solder Preforms by Coining
Coining is a diverse world-class manufacturer of interconnect solutions for the microelectronics industry. Coining’s product range can be divided into several groups: bonding wire & ribbon in gold, aluminium, silver, copper, etc.; solder preforms and ribbon in all alloy compositions; precision stampings in a wide range of metals, clad to other metals or solder alloys; & package cover lid assemblies.
Coining is a leading provider of quality fine gold, aluminium and alloyed wire, which is sold to a diverse customer and application base, including hybrid, medical and automotive manufacturers. Coining’s special proprietary wire alloys and doping recipes, combined with its extensive wire manufacturing capabilities in the US and Malaysia, make their products the preferred choice for their global customers.
In 2009, Coining acquired Semiconductor Packaging Materials (SPM) and in May 2011, Coining itself was acquired by AMETEK, Inc., a large public corporation with annual revenues approaching $3 billion and headquartered in Berwyn, PA near Philadelphia, USA. Coining is now part of AMETEK’s Precision and Engineered Materials Business Unit within AMETEK Specialty Metal Products.
Coining is qualified to ISO 9002, QS9000 and ISO14001 and serves the following industries:
- Medical Electronics
- Fibre Optics
- Semiconductor Back-end Assembly etc.
Bonding Wire & Ribbon
Gold wire, fine & heavy aluminium wire, silver, nickel and copper bonding wire, all available in ribbon format.
Solder Preforms & Ribbon, and Metal Stampings
An extensive range of solder preforms, ribbons and precision metal stampings.
Package Cover Assemblies
Cover Assemblies used to hermetically seal electronic packages.
Welding Electrodes and Hot Bar Thermodes
Bonding Wedges and Collets
Vacuum Reflow Ovens
Bond and Materials Test Equipment
Automatic Wire Bonders
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonic Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region