Bonding Wire and Ribbon

Coining, an Ametek company, is a world-class manufacturer of high-purity bonding wire and ribbon that include gold, aluminium & copper wires & ribbons. These are extensively used in the manufacturing of semiconductor and microelectronic devices as the electrical interconnect either between a chip and substrate, between two chips, or between two substrates.

  • Gold bonding wire, up to 99.99% purity, diameters from 12.5µm (0.0005″) to 125µm (0.005″)
  • Gold ribbon, as thin as 6µm (0.00025″), with widths up to 625µm (0.025″)
  • Fine 1% silicon aluminium bonding wire, from 18µm (0.0007″) to 75µm (0.003″)
  • Aluminium bonding wire, up to 99.999% purity, diameters from 125µm (0.005″) to 500µm (0.020″)
  • Aluminium ribbon, from 750µm x 75µm (0.030″ x 0.003″) to 2mm x 300µm (0.080″ x 0.012″)
  • Other materials include silver, nickel and copper bonding wires and ribbons

All materials used by Coining are of the highest quality, refined and alloyed to produce the properties demanded of finished wire and ribbon products.

For information on bonding wire properties that should be considered when selecting a wire type, please look at our Knowledge Based Fact Sheet here.

Further Information

Contact Us

Tel: +44 (0)1264 334505



Wire Bonding, Ribbon Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Coining Website


Available from Inseto in the United Kingdom, Ireland & Nordic Region

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