Si/Al Bonding Wire
Si/Al Bonding Wire Key Features
- Fine aluminium bonding wire alloyed with 1% silicon
- Diameters from 18µm (0.0007″) to 75µm (0.003″)
- Microscopic checks of the alloy structure of the finished lots
- Snag-free de-reeling
In order to ensure that uniform high quality bonds can be obtained at high production speeds, special controls are used in the manufacture of 1% silicon-aluminium wire.
At Coining, special attention is given to the most important characteristic of high grade bonding: homogeneity. Microscopic checks of the alloy structure of the finished lots of 1% silicon-aluminium wire are routinely performed.
Wire processing is carried out under conditions that yield the ultimate in surface cleanliness and smooth finish and permits entirely snag-free de-reeling.
Ultrasonic Wedge Bonding Tool
IBond5000 Wedge Bonder
IBond5000 Dual – Convertible Ball & Wedge Bonder
Bond & Materials Test Equipment
Technical Support Services
Knowledge Base Articles
Bonding Wire Sizes & Selection (IKB-037)
Bond Wire Handling Considerations (IKB-023)
MPP Bonding Wedge Tool Nomenclature (IKB-010)
MPP Fine Wire Wedge Tool: Feed Hole to Wire Diameter Recommendations (IKB-065)
Fine Wire Wedge Bond Sequence (IKB-002)
Understanding Wire Pull Testing (IKB-003)
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region