Inseto
Inseto

Si/Al Bonding Wire

Si/Al Bonding Wire Key Features

  • Fine aluminium bonding wire alloyed with 1% silicon
  • Diameters from 18µm (0.0007″) to 75µm (0.003″)
  • Microscopic checks of the alloy structure of the finished lots
  • Snag-free de-reeling

In order to ensure that uniform high quality bonds can be obtained at high production speeds, special controls are used in the manufacture of 1% silicon-aluminium wire.

At Coining, special attention is given to the most important characteristic of high grade bonding: homogeneity. Microscopic checks of the alloy structure of the finished lots of 1% silicon-aluminium wire are routinely performed.

Wire processing is carried out under conditions that yield the ultimate in surface cleanliness and smooth finish and permits entirely snag-free de-reeling.

Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form