Aluminium Bonding Ribbon
Aluminium Ribbon Key Features
- High-purity aluminium for high power applications
- Custom-manufactured to exacting specifications
- Very tight dimensional tolerances of ±3%
- Fewer connections required than wire results in reduced process time
Coining produces aluminium ribbon for high power applications. These ribbons are typically custom-manufactured to exacting specifications, producing unparalleled uniformity of width and thereby minimising snagging in the bonding wedge, resulting in significant reductions of machine downtime.
In high power applications that traditionally used aluminium wire, the advantage of switching to aluminium ribbon results in increased cycle times by reducing process times, achieved by eliminating the need for multiple wire bonds in devices. For example, 8 wire bonds of 125µm diameter can be replaced by 1 ribbon bond of 1mm x 100µm. Reducing the number of bonds also increases the reliability of the end product.
Ultrasonic Wedge Bonding Tool
Automatic Wedge Bonders
Ultrasonic Battery Bonders
Semiconductor Leadframe Wedge Bonders
Bond & Materials Test Equipment
Knowledge Base Articles
Wire Bonding Battery Connections (IKB-069)
Bond Wire Handling Considerations (IKB-023)
Understanding Wire Pull Testing (IKB-003)
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Solder Die Attach For High Power Applications (IKB-016)
How IR Induction Furnaces Work (IKB-024)
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region