Copper Bonding Wire
Copper Bonding Wire Key Features
- Suitable for fine wire ball bonding up to 75µm
- Suitable for wedge bonding up to 250µm
- Packaging protects the wire and achieves a longer shelf life
Today copper wire is one of the preferred materials for wire bonding interconnects in many semiconductor and microelectronic applications.
The advantages of using copper are well documented and because of these advantageous characteristics it is being used for fine wire ball bonding up to 75µm and for wedge bonding up to 250µm.
It has the ability to be used at smaller diameters, producing the same performance as gold without the high material cost.
Coining uses special packaging in order to protect the wire and achieve a longer shelf life.
Ultrasonic Wedge Bonding Tool
IBond5000 Wedge Bonder
IBond5000 Dual – Convertible Ball & Wedge Bonder
Bond & Materials Test Equipment
Technical Support Services
Knowledge Base Articles
Bonding Wire Sizes & Selection (IKB-037)
Bond Wire Handling Considerations (IKB-023)
MPP Bonding Wedge Tool Nomenclature (IKB-010)
MPP Fine Wire Wedge Tool: Feed Hole to Wire Diameter Recommendations (IKB-065)
Fine Wire Wedge Bond Sequence (IKB-002)
Understanding Wire Pull Testing (IKB-003)
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region