Copper Bonding Wire

Copper Bonding Wire Key Features

  • Suitable for fine wire ball bonding up to 75µm
  • Suitable for wedge bonding up to 250µm
  • Packaging protects the wire and achieves a longer shelf life

Today copper wire is one of the preferred materials for wire bonding interconnects in many semiconductor and microelectronic applications.

The advantages of using copper are well documented and because of these advantageous characteristics it is being used for fine wire ball bonding up to 75µm and for wedge bonding up to 250µm.

It has the ability to be used at smaller diameters, producing the same performance as gold without the high material cost.

Coining uses special packaging in order to protect the wire and achieve a longer shelf life.

  • Coining overview

Copper Bonding Wire Technical Downloads


Technical Data Sheet for Copper Bonding Wire


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Further Information

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Wire Bonding, Ribbon Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices


Available from Inseto in the United Kingdom, Ireland & Nordic Region

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