Gold Bonding Ribbon
Gold Ribbon Key Features
- High-purity gold for high frequency and high bit rate applications
- Custom-manufactured to exacting specifications
- Very tight dimensional tolerances of ±3%
- Less machine downtime due to tolerances
Coining produces gold ribbon for RF/microwave and high bit rate applications. These ribbons are typically custom-manufactured to exacting specifications, producing unparalleled uniformity of width and thereby minimising snagging in the bonding wedge, resulting in significant reductions of machine downtime.
The advantage of ribbon over round wire is the relatively large surface area in proportion to the cross-section area. The more extreme this relationship, the less effect that frequency has on the effective resistance of the material, resulting in greater efficiency of ribbon-bonded products. Since a majority of the free electrons are near the surface anyway, the resistance caused by the skin effect does not have such a drastic impact on the ribbon as it does on round wire.
In addition, signal crosstalk is significantly reduced in ribbon-bonded applications, leading to better signal quality in high frequency devices, and less electrical noise on the supply or ground contacts. This is because, while at lower frequencies the parasitic capacity of the wire-antenna may be neglected, in the GHz range wires really start to exchange signals, leading to increased interference.
Wire Bond Wedge Tool
IBond5000 Wedge Bonder
IBond5000 Dual – Convertible Ball & Wedge Bonder
Thin Film Metalised Substrates
RF & Microwave Packages
Knowledge Base Articles
Bond Wire Handling Considerations (IKB-023)
MPP Bonding Wedge Tool Nomenclature (IKB-010)
MPP Fine Wire Wedge Tool: Feed Hole to Wire Diameter Recommendations (IKB-065)
MPP Ribbon Wedge Tool: Slot Size to Ribbon Size Recommendations (IKB-066)
Fine Wire Wedge Bond Sequence (IKB-002)
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region