Gold Bonding Wire

Coining specialises in manufacturing high-purity (up to 99.99%) gold wire for ball bonding and wedge bonding processes. In-house casting, drawing, rolling, annealing, plus complete analytic capabilities, ensure a finished product that is completely homogeneous, with ultra-clean surfaces and a smooth finish.

Coining manufactures gold wire in a full range of diameters – 12.5µm (0.0005″) to 125µm (0.005″) – that meet customer requirements for strength and hardness / elongation in all applications.

The gold wire is high-purity vacuum-processed from highly refined metals and provided on a wide range of wire spool types, suitable for use on all models of wire bonding equipment. Applications include interconnect of semiconductor devices, wafer bumping, stud bump and interconnect of other microelectronic and related assemblies.

By using strictly controlled doping processes, Coining has a long-standing reputation for providing custom wire properties for specialised applications using automatic wire bonders. Wire is also supplied for use on manual equipment.

For information on bonding wire properties that should be considered when selecting a wire type, please look at our Knowledge Based Fact Sheet here.