Gold Bonding Wire
Gold Bonding Wire Key Features
- 99.99% gold bonding wire (other variants available)
- High-purity vacuum-processed from highly refined metals
- Diameters from 12.5µm (0.0005″) up to 125µm (0.005″)
- Uniform elongation and tensile strength across the complete spool
- For manual and automatic wire bonding equipment
- Manufacturing process controls ensure enhanced looping
Coining specialises in manufacturing high-purity (up to 99.99%) gold wire for ball bonding and wedge bonding processes. In-house casting, drawing, rolling, annealing, plus complete analytic capabilities, ensure a finished product that is completely homogeneous, with ultra-clean surfaces and a smooth finish.
Coining manufactures gold wire in a full range of diameters – 12.5µm (0.0005″) to 125µm (0.005″) – that meet customer requirements for strength and hardness / elongation in all applications.
The gold wire is high-purity vacuum-processed from highly refined metals and provided on a wide range of wire spool types, suitable for use on all models of wire bonding equipment. Applications include interconnect of semiconductor devices, wafer bumping, stud bump and interconnect of other microelectronic and related assemblies.
By using strictly controlled doping processes, Coining has a long-standing reputation for providing custom wire properties for specialised applications using automatic wire bonders. Wire is also supplied for use on manual equipment.
For information on bonding wire properties that should be considered when selecting a wire type, please look at our Knowledge Based Fact Sheet here.
Wire Bond Wedge Tools
Manual Wire Bonders
Automatic Ball Bonders
Automatic Wedge Bonders
Knowledge Base Articles
Bonding Wire Sizes & Selection (IKB-037)
Bond Wire Handling Considerations (IKB-023)
Kulicke & Soffa Capillary Nomenclature (IKB-011)
MPP Bonding Wedge Tool Nomenclature (IKB-010)
Ball Bond Sequence (IKB-001)
Fine Wire Wedge Bond Sequence (IKB-002)
Understanding Wire Pull Testing (IKB-003)
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region