Inseto
Inseto

Cover Assemblies & Package Lids for Microelectronic Devices

Cover Assemblies & Package Lids Key Features

  • Metal & ceramic cover assemblies
  • Fully automated handling with vision system
  • Consistent, repeatable high-quality parts
  • Minimal raised material in weld area
  • Tightly controlled weld penetration

Coining Cover Assemblies (package lids) offer many advantages for the hermetic sealing process of electronic packages over techniques using separate solder preforms and covers. The base materia is electroplated with nickel for solderability and to prevent corrosion in the future. The part is then electroplated with gold to provide a highly solderable surface.

Designed and manufactured by Coining, they provide the necessary hermetic seal for delicate electrical components in even the harshest of environments. Coining cover assemblies improve on the traditional methods of assembly, aligning and attaching individual parts by supplying one integrated cover assembly that mates to the package.

Cover Assembly Assembly Base Composition: Typically Kovar™ or Alloy 42. Aluminium alloys, Titanium and Stainless Steel are available upon request.

Plating: Typically Nickel plating per QQ-N-290, 50 – 350µ” thick followed by Gold electroplating per MIL-G-45204, Type III, Grade A, 50µ” thick minimum. Alternate plating schemes, including four-layer plating and customer specific thicknesses, are available upon request. Base will meet the requirements of MIL-M-38510.

Processing Information: We recommend a typical clip force of 0.9 – 2 lbs. Clip force varies depending on lid cover size, preform thickness, lid flatness, and seal-ring flatness. Typical sealing profiles allow for 2 – 5 minutes above 280°C (melting temperature) with a peak temperature not exceeding 340°C in dry nitrogen, or hydrogen.

Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

Request Form