Precision Metal Stampings
Precision Metal Stampings Key Features
- Custom developed stampings in dimensions as small as 100µm (0.004″)
- Ability to create precision stampings from a variety of metals
- Most common are aluminium, copper, Molybdenum & Kovar
- Optional plating – Ni, Au
- Cladding service also available: metal to metal & solder to metal
Coining makes small metal stampings that are used as jumper chips, bonding pads, covers, heat sinks, lead frames, tabs, terminals or other components on microelectronic assemblies and packages. These precision stampings are used primarily to dissipate heat or provide an interface for an electronic circuit or component.
Coining works with Kovar™ , molybdenum, tungsten, copper, aluminium and various other metallic materials commonly found in metal and ceramic packages. Some of these parts are supplied after nickel plating or gold plating. Other Coining stampings are manufactured from clad strip consisting of two or more metal layers bonded together in a specialty rolling operation, also called metallic bonding.
Coining utilises its own in-house tooling department to review, design and build tooling to customer specifications. They also use progressive dies to create a variety of 3 dimensional configurations, or EDM-built tools to provide extraordinary precision and variety to the geometries of their parts. Coining primarily focuses on two-dimensional microstampings with constant cross-sectional thicknesses less than 0.75mm (0.030″).
Tel: +44 (0)1264 334505
Wire Bonding, Ribbon Bonding, Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Available from Inseto in the United Kingdom, Ireland & Nordic Region