Inseto
Inseto

Dicing Blades and Accessories by ADT

ADT manufacture an extensive range of high-quality, hub-less dicing blades to suit a wide variety of cutting and scribing applications, including dicing ceramics, LTCC, glass, metals, sapphire, ferrite, silicon etc.

ADT’s continually develop their hub-less dicing blades to provide reduced wear and improved life with high dimensional accuracy, resulting in precision dicing and excellent cost-of-ownership (CoO).

Choosing the right blade to suit your application is crucial to the success of your dicing process. To offer the widest range of process capabilities, ADT produces three different product families of dicing blade, which are composed of abrasive materials embedded in either resin or metal matrix, including: resin blades, nickel blades and metal sintered blades.

Resin bond Blades are cured under pressure and high temperature, Metal-bond Blades are sintered and Nickel-bond Blades are manufactured using a tightly controlled electroforming process.

ADT - Advanced Dicing Technologies

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.

ADT Website

www.adt-co.com

Region

Available from Inseto in the United Kingdom, Ireland & Nordic Region

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