Annular Dicing Blade and Accessories by ADT
ADT manufacture an extensive range of high-quality, annular dicing blade types, also known as hubless blades, to suit a wide variety of cutting and scribing applications, including dicing ceramic (LTCC, Alumina etc.) glass, metals, sapphire, ferrite and silicon etc.
ADT’s continually develop their annular dicing blades to provide reduced wear and improved life with high dimensional accuracy, resulting in precision dicing and excellent cost-of-ownership (CoO).
Choosing the right blade to suit your application is crucial to the success of your dicing process. To offer the widest range of process capabilities, ADT produces three different product families of dicing blade, which are composed of abrasive materials embedded in either resin or metal matrix, including: resin blades, nickel blades and metal sintered blades.
Resin bond Blades are cured under pressure and high temperature, Metal-bond Blades are sintered and Nickel-bond Blades are manufactured using a tightly controlled electroforming process.
For information on annular dicing blade properties that should be considered when selecting a blade type, please look at our Knowledge Based Fact Sheet here.
Resin Dicing Blades
Excellent choice for hard and brittle materials, e.g.: Ceramic, Quartz, Glass QFN HTCC etc.
Nickel Dicing Blades
Provides longer blade life and lower wear rate, ideal for softer materials such as: PCB, Silicon and BGA etc.
Metal (Sintered) Dicing Blades
Slower wear rate than Resin but faster than Nickel, ideal for: BGA, Soft Alumina, TiC, LTCC, Ferrite etc.
Annular Dicing Blade Flanges & Accessories
Available for all blade types in the range of 2″- 5″.
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region