Nickel Bond Dicing Blade
Nickel Bond Dicing Blade Key Features
- The Nickel binder provides superior blade life and lower wear rate
- Ideal for soft material applications such as: PCB, Silicon and BGA
- The thinnest blade available, down to .0008”
- Excellent rigidity for higher exposure
- Blade thickness up to 0.020″ mil
- Diamond grit size ranges from 2-4 microns to 70 microns
Annular Nickel Bond Dicing Blade from ADT are produced using a state-of-the-art, tightly controlled electro-forming process, which guarantees a uniform distribution of diamonds throughout the Nickel layer. This process not only allows for blades to be produced to very tight tolerances but also permits optimization of grit size, hardness and geometry to meet the particular requirements of your application.
The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA’s.
Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size) and diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness).
Please contact us with your specific application or dicing blade requirements.
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region