Ex-Stock Semiconductor Metal, Ceramic and Plastic Packages and Lids
Ex-Stock Semiconductor Packages and Lids Key Features
- Extensive range of hermetic and plastic packages and lids in stock
- Full traceability on all items
- Ideal for universities, research institutes, prototyping and test requirements
- Power Transistor Outline (TO) Packages
- Hybrid Packages – Ceramic and Metal
- Ceramic Pin Grid Array Packages (CPGA)
- Ceramic Quad Flat Pack (CQFP)
- Ceramic Small Outline Packages (CSOP)
- Flat Packs
- Ceramic Small Outline Packages (CSOP)
- Cerquads – EIJA and JEDEC
- Cerpacs
- CERDIPs
- J Lead Chip Carriers Ceramic
- Leadless Chip Carriers (LCC)
- Side Braze Packages
- Microwave Transistor (Micro-T) Packages
- Plastic Equivalent Packages
- Plastic Pin Grid Array Packages (PPGA)
- Lids for above packages etc.
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Further Information
Applications
High Reliability Hermetic Glass And Ceramic Sealed Assemblies, High Reliability Glass Sealed Feed-Throughs, Ceramic Feed-Throughs, Microwave Assemblies, Detonator Fuses, Vacuum Seals, Optical Component Headers, Hermetic Switch Components, High Pressure Connectors, Military & Civil Aviation Connectors, Custom Sight Glass Windows, Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages
Industry Segments
Microelectronic / Hybrid Assembly Industries, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, Military & Civil Aviation, Telecommunications, Satellite / Space Electronics, Oil Exploration & Production, Wireless Internet Infrastructure, Aerospace, Industrial, Power Semiconductor Assembly etc.
Region
Available from Inseto throught Europe.
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