Hermetic Ceramic and Metal Microelectronic Packages by Egide
Egide is a leading-edge manufacturer of high reliability hermetic packages, housings and enclosures. Founded in France in 1986, Egide has evolved to become a marquee name in the world of hermetic packages for critical applications with manufacturing plants in Europe and the US.
Certified to both ISO 9001:2008 & ISO 14001:2004, Egide offers consistently high quality products that are manufactured in an environmentally-friendly environment. All Egide products are manufactured to the industry-standard MIL-STD-883.
Egide designs and manufactures hermetic packages to protect and interconnect fragile electronic or photonic ICs, which are sensitive to harsh thermal, atmospheric, or magnetic environments. These packages are the product of complex expertise, drawing upon several disciplines: material structure, particularly specialised alloys, chemistry and surface treatment, mechanics and thermodynamics, electronics, optoelectronics, and high frequency modeling.
Egide is one of the few companies to master all of the technologies surrounding the two types of material used for these packages in the world today: glass-to-metal and ceramic-to-metal.
In its state-of-the-art manufacturing in Bollène, France, Egide manufactures both ceramic-sealed and glass-sealed hermetic packages. A 500 sq-metre Class 10,000 cleanroom designed specifically for treatment of raw ceramic ensures that the entire ceramic manufacturing process is completely controlled in-house. The same facility provides assembly, surface treatment and full control of glass-sealed packages, and includes Egide’s own glass bead manufacturing process.
Egide is certified to ISO 9001:2015 and ISO 14001:2004. It is also certified by ASD-EASE (AeroSpace and Defence – European Aerospace Supplier Evaluation). Egide USA is also certified to ISO 9001:2015.
Hermetic Power Packages
Glass-To-Metal-Seal (GTMS) and Ceramic-to-Metal-Seal (CTMS) packages.
RF and Microwave Packages
Wide variety of RF packages for various markets.
Thermal Imaging HTCC Packages
Custom design and manufactured packages for the thermal imaging market.
Both GTMS and CTMS options are offered.
Bathtub Packages & Flatpacks
Comprehensive solutions to the more traditional hybrid thick film technologies.
Ex-Stock Semiconductor Packages
Thin Film Metalised Substrates
Thick Film Materials
Solder Preforms and Stampings
Die Attach Adhesives
Manual & Semiautomatic Die Bonders
Automatic Die Bonders
Vacuum Reflow Ovens
Manual Wire Bonders
Bond & Materials Test Equipment
Tel: +44 (0)1264 334505
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region