Bathtub Packages and Flatpacks
Bathtub Packages and Flatpacks Key Features
- Compression sealed and matched sealed options
- Complete in-house plating capabilities
- All packages manufactured to MIL-STD-883 as minimum
- Full in-house testing capability to MIL-PRF-38534
Egide offers comprehensive solutions to the more traditional hybrid thick-film technologies. It has been manufacturing glass-to-metal-sealed packages since its inception in 1986, so has a long and extensive history with these types of packages. It has numerous conveyor furnaces for all joining process, from low-temperature soldering to high-temperature brazing.
A wide range of bathtub packages (sometimes called “plug-ins”) and flatpacks, usually made from KovarTM, compliments more specialised requirements in the Power & RF markets. Fully automated, computer-controlled electroplating lines ensure that the most critical process in hermetic package manufacturing is under complete control.
Egide offers both compression sealing and matched sealing. In compression-sealed packages, the reliability of the seal is guaranteed by the thermal expansion of glass and metal creating the necessary concentric compressive stress to meet stringent hermeticity requirements. The matched sealing process uses the match of the thermal expansion coefficients of Kovar and glass over a wide temperature range. An oxide layer created between metal and glass provides for the hermeticity and electrical insulation.
Thin Film Metalised Substrates
Solder Preforms & Ribbon
Die Attach Adhesives
Die Bonding Tools & Collets
Bonding Wire & Ribbon
Manual & Semiautomatic Die Bonders
Vacuum Reflow Ovens
IBond5000 Wedge Bonder
Bond & Materials Test
Technical Support Services
Knowledge Base Articles
How IR Induction Furnaces Work (IKB-024)
Adhesives for Die Attach (IKB-071)
Die Attach Process: Guidance and Setup (IKB-072)
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Tel: +44 (0)1264 334505
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region