Optoelectronic Packages

Optoelectronic Packages Key Features

  • Wide range of fibre-optic packages
  • Markets include submarine, long-haul, metro, etc.
  • Mix of technologies – metal, HTCC, GTMS, CTMS
  • Dedicated customer-facing Field Application Engineering department

Over the last 2 decades, opto-electronic devices have found their way into various applications like high-speed telecommunication networks, data center interconnection, gas sensing, thermal imaging, gyroscopes, etc. High-speed fiber-optic networks have increased the need for high density complex interconnection solutions. 

Egide’s multilayer high-temperature co-fired ceramic (HTCC) technology, together with complete in-house RF simulation capabilities, makes it a unique player in the market for high frequency / high bit rate packages used for 100G & 400G TOSA/ROSA and modulator designs.

Opto-electronic sensors are used in a wide variety of applications, some of which are in harsh environmental conditions. Egide’s hermetic packaging technology, ensuring protection and interconnection of the opto-electronic ICs, meets the most stringent requirements that these environments impose. Examples are gas sensing in industrial environment, fiber-optic gyroscopes, etc.

Both GTMS (glass-sealed) and CTMS (ceramic-sealed) options are offered, as well as in-house manufactured RF terminals and DC pin assemblies.

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Tel: +44 (0)1264 334505



High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.

Industry Segments

Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.

Egide Website


Available from Inseto in the United Kingdom, Ireland & Nordic Region

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