Optoelectronic Packages Key Features
- Wide range of fibre-optic packages
- Markets include submarine, long-haul, metro, etc.
- Mix of technologies – metal, HTCC, GTMS, CTMS
- Dedicated customer-facing Field Application Engineering department
Over the last 2 decades, opto-electronic devices have found their way into various applications like high-speed telecommunication networks, data center interconnection, gas sensing, thermal imaging, gyroscopes, etc. High-speed fiber-optic networks have increased the need for high density complex interconnection solutions.
Egide’s multilayer high-temperature co-fired ceramic (HTCC) technology, together with complete in-house RF simulation capabilities, makes it a unique player in the market for high frequency / high bit rate packages used for 100G & 400G TOSA/ROSA and modulator designs.
Opto-electronic sensors are used in a wide variety of applications, some of which are in harsh environmental conditions. Egide’s hermetic packaging technology, ensuring protection and interconnection of the opto-electronic ICs, meets the most stringent requirements that these environments impose. Examples are gas sensing in industrial environment, fiber-optic gyroscopes, etc.
Both GTMS (glass-sealed) and CTMS (ceramic-sealed) options are offered, as well as in-house manufactured RF terminals and DC pin assemblies.
Optoelectronic Packages Technical Downloads
Egide Fibre-Optic Packages Flyer
Egide Design Guidelines – General Process Materials
Egide Design Guidelines – Standard Routing Design
Tel: +44 (0)1264 334505
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region