RF and Microwave Packages
RF and Microwave Packages Key Features
- World leader in high frequency & RF transition technology
- Dedicated customer-facing Field Application Engineering department
- Target of 100 GHz capability currently under development
- In-house ceramic (HTCC) capability
Egide designs and manufactures a wide variety of RF packages for various markets. Frequency capabilities range from S-band all the way up the spectrum to V-band.
Its state-of-the-art RF simulation capability, combined with in-house ceramic technology and assembly processes, ensures that the most demanding applications are met for hermeticity, high frequency, and thermal management. Egide’s dedicated Field Application Engineers work directly with customers to ensure that the fully assembled device meets all customers requirements. File sharing using HFSS and SolidWorks ensure that the package designed in collaboration with customers, and manufactured at Egide, performs as required in the relevant frequency band(s).
RF designs can use either KovarTM or aluminium materials as standard, combined with high-temperature co-fired alumina manufactured at Egide. In-house electroless and electrolytic plating complete the assembly, ensuring total process control within Egide.
RF and Microwave Packages Technical Downloads
Egide RF Packages Flyer
Egide Design Guidelines – General Process Materials
Egide Design Guidelines – Standard Routing Design
Thin Film Metalised Substrates
Solder Preforms & Ribbon
Die Attach Adhesives
Bonding Wire & Ribbon
Bond & Materials Test Equipment
Knowledge Base Articles
How IR Induction Furnaces Work (IKB-024)
Adhesives for Die Attach (IKB-071)
Die Attach Process: Guidance and Setup (IKB-072)
MPP Bonding Wedge Tool Nomenclature (IKB-010)
MPP Ribbon Wedge Tool: Slot Size to Ribbon Size Recommendations (IKB-066)
Tel: +44 (0)1264 334505
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region