Thermal Imaging HTCC Packages
Thermal Imaging HTCC Packages Key Features
- Packages for cooled and un-cooled detectors
- Tested for hermeticity to 10-10 cm3/s atm
- HTCC manufactured in-house
- Complete assembly and plating in the EU
Egide customs designs and manufactures packages for the thermal imaging market based upon its proven, reliable HTCC (High Temperature Co-fired Ceramic) technology. All ceramic parts are manufactured in-house from basic inks and powders up to the finished multi-layered product, with gold plated tracks and tungsten-filled vias.
Egide governs the components and the design, ensuring tight dimensional control and problem-free integration, resulting in assembled devices of the highest quality and reliability. Glass-sealed packages are also available. All Egide packages are tested for hermeticity to 10-10 cm3/s atm and the high temperature process reduces critical pumping time. The assembled parts can be plated with electrolytic or electroless nickel and electrolytic or electroless gold.
Egide also plates copper tracks on ceramic for high power applications. They offer much more than just the basic package, adding TECs, getter holders, copper pinch-off tubes, window holders and envelopes as required, so that all customers receive a more complete component and save in-house production space for other requirements.
Thermal Imaging HTCC Packages Technical Downloads
Egide – Products for Thermal Imaging
Egide Design Guidelines – General Process Materials
Egide Design Guidelines – Standard Routing Design
Thin Film Metalised Substrates
Solder Preforms & Ribbon
Die Attach Adhesives
Bonding Wire & Ribbon
Bond & Materials Test Equipment
Knowledge Base Articles
How IR Induction Furnaces Work (IKB-024)
Adhesives for Die Attach (IKB-071)
Die Attach Process: Guidance and Setup (IKB-072)
Tel: +44 (0)1264 334505
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Available from Inseto in the United Kingdom, Ireland & Nordic Region