Inseto
Inseto

SOI Wafer

SOI Wafer Key Features

  • PRIME grade high-quality SOI wafer
  • Exceptional device layer TTV control
  • 3” to 200mm wafers available
  • Bonded SOI from device layers of 1.5um to >300um
  • Any dopant and Si orientation
  • Backside with oxide coating and laser marking available
  • Supply and Shipment Worldwide from Stock or on short lead times

Inseto is a specialist in supplying Bonded SOI (BSOI) wafer with device layer thickness of >1.5um and exceptional device layer TTV and flatness. Wafers sizes from 3” to 200mm can be made in short lead-times and small lot sizes are also available.

Direct Si-Si bonded wafers and Double bonded SOI are also available, along with thick device layers>300um, Box thickness 0.5-10um, and any dopant or orientation. We can also have wafers with oxide on the backside as well as laser marking on front or backside.

Our high-quality Si Wafers are shipped and used worldwide by University and Industrial Research, Manufacturing and equipment manufacturers. Please do not hesitate to contact our support team for application and technical advice, if you need assistance specifying your wafers.

Product range overview

SOI Wafers:

  • SOI Wafer sizes from 3” to 200mm, some in inventory
  • Very high quality with tight TTV on device layer thickness
  • Direct Si-Si bonding and double sided SOI available
  • Any Si orientation, any device thickness over 1.5um
  • Single and double side polished
  • Small lot sizes and Laser marking of wafers available
  • Short lead time delivery
  • SOI Wafers in Process

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Graphene, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewable, Energy Harvesting etc.

Industry Segments

Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.

Region

Available Worldwide from Inseto

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