Inseto
Inseto

Thick Film Gold Conductors

Gold Conductive Pastes Key Features

  • Suitable for all processes – etchable, solderable, etc.
  • Gold and aluminium wire bondable
  • Wide range of firing temperatures (500 – 1,050ºC)
  • Thinners available for extended working life (information on-demand)

Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thick-film pastes for a wide variety of Hybrid Microelectronic applications.

Their Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.

The range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free materials.

Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free products.

Thick Film Conductive Pastes Technical Downloads

File

Koartan Thick Print Gold Paper – IMAPS2002

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Gold Thick Film Conductor Product Range

Part#

Type

Description

Part#

4000

Type

Repair, plug

Description

100% gold paste, for track repair on hybrids, can also plug pin-holes, fires at 850ºC

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Part#

4100

Type

Au Bondable

Description

Gold wire bondable paste for multilayering & general use, fires at 850ºC

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Part#

4101

Type

Au Via Fill

Description

Gold via fill conductor for small & large via holes, fires at 850ºC

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Part#

4129

Type

Au & Al bondable

Description

Cd & Pb Free for fine line printing, fires at 850ºC

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Part#

4150QJ

Type

Au bondable

Description

High electrical conductivity, fine line printing, fires at 850ºC

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Part#

4171

Type

Au bondable

Description

Good line resolution, straight edges, smooth surface, ideal for RF applications, fires at 850ºC

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Part#

4225

Type

Al and Au bondable

Description

Heavy aluminium wire and gold wire bondable, fires at 850ºC

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Part#

4496

Type

Solderable

Description

Top-layer solderable gold with excellent leach resistance and aged adhesion, fires at 850ºC

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Part#

4505

Type

Au bondable

Description

Low temperature, suitable for glass circuits & resistor CCT repair, fires at 500°C

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Part#

4530

Type

Pull-thru

Description

High binders for pull-thru & edge painting, low ESR, fires at 850ºC

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Part#

4540

Type

Plug

Description

Very high solids paste for plugging holes in the substrate, fires at 850ºC

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Part#

4541

Type

Plug

Description

Very high solids paste for plugging holes in the substrate, fires at 850ºC

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Part#

4550

Type

Etchable

Description

Etchable gold with excellent fired density, wire bondable, suitable for RF, fires at 850ºC

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Part#

4551

Type

Etchable

Description

Etchable gold, thin printed, wire bondable, suitable for RF, fires at 850ºC

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Part#

4583

Type

Solderable

Description

Ultra thin-print, laser trimable, fires up to 1050°C

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Part#

4586

Type

Solderable

Description

Thin-printing, economical solderable gold, fires at 850ºC

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Part#

4906

Type

AlN gold

Description

Low temperature gold for AlN, fires at 600ºC

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Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors

Industry Segments

Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics

Koartan Website

www.koartan.com

Region

Available througout Europe from Inseto

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