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Thick Film Silver Conductors

Silver Conductive Pastes Key Features

  • Suitable for all processes – etchable, solderable, etc.
  • Wide range of firing temperatures (450 – 1,050ºC)
  • Thinners available for extended working life (information on-demand)

Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thick-film pastes for a wide variety of Microelectronic Hybrid applications.

Their range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free products.

Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free materials.

Koartan Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.

Thick Film Conductive Pastes Technical Downloads

File

Koartan Thick Print Gold Paper – IMAPS2002

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Silver Thick Film Conductor Product Range

Part#

Type

Description

Part#

6101

Type

Via Fill

Description

Low shrinkage paste for filling large via holes in multilayer dielectrics, fires at 850ºC

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Part#

6107

Type

High conductivity

Description

Termination metalisation on chip resistors, and for very small components, fires at 850ºC

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Part#

6111

Type

Plateable

Description

General purpose, excellent line resolution, suitable for RF applications, fires at 850ºC

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Part#

6120

Type

100% Ag

Description

Fine line, general purpose, inner multi-layer trace, fires at 850ºC

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Part#

6122

Type

AlN Silver

Description

High adhesion silver conductor for aluminum nitride (AlN), fires at 850ºC

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Part#

6125

Type

Low resistivity

Description

High solids content, thick printing for low resistivity applications, fires at 850ºC

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Part#

6130

Type

Thru-hole

Description

Thin, highly conductive coating for the inside of holes and castellations, fires at 850ºC

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Part#

6150

Type

Etchable

Description

High conductivity, 100% silver for etching fine lines, fires at 850ºC

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Part#

6160

Type

General purpose

Description

For high density microelectronic hybrid applications, fires at 850ºC

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Part#

6165

Type

High conductivity

Description

Low temperature firing, high electrical conductivity, fire at 500°C

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Part#

6165-SI

Type

Silicon silver

Description

Low temperature firing, for use on silicon substrates, high electrical conductivity, fires at 450°C

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Part#

6166

Type

Solderable

Description

Low temperature, high conductivity, for resistor terminations, fires at 600°C

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Part#

6168

Type

General purpose

Description

For cost sensitive applications, excellent conductivity and adhesion, fires at 850°C

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Part#

6550-1

Type

Etchable

Description

For very thin metalisation applications, multi-layer, fires at 850ºC

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Part#

6716

Type

Plasma silver

Description

For plasma displays, excellent adhesion to soda-lime glass, fires at 500ºC

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Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors

Industry Segments

Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics

Koartan Website

www.koartan.com

Region

Available througout Europe from Inseto

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