Equipment
Inseto’s Equipment Division provides manufacturing, test and inspection equipment for the Electronic, Microelectronic, Photonic, Photovoltaic and Semiconductor industries etc., including lithography equipment for mask alignment, resist coating and development, semiconductor furnaces, wafer bonders, probing systems, dicing saws and diamond scribing machines, die bonders and sorters, sinter bonding systems, inspection equipment, ultrasonic wire bonding machines, plasma cleaners and etching systems, vacuum solder reflow ovens, material testers for wire pull and shear testing etc.
Full technical support including process, operation and maintenance is provided, with extensively trained field personnel and information databases. Training either at Inseto’s training facility or onsite, can be provided to maximise equipment productivity and optimise quality of results.

Inspection Equipment

More
Ink Jet Printing

More
Wafer Coating-Developing

More
Mask Aligners

More
Photomask Equipment

More
Wafer Furnaces

More
Wafer Bonders

More
Wafer Solder Bumping

More
Plasma Cleaning and Etching

More
Wafer Probers

More
Laser Trimming

More
Dicing Equipment

More
Scribing Equipment

More
Die Bonders: Manual & Semiautomatic

More
Die Bonders: Automatic

More
Vacuum Reflow Ovens

More
Sinter Die Attach

More
Wire Bonders: Manual

More
Wire Bonders: Automatic Ball-Bump Bond

More
Wire Bonders: Automatic Wedge Bond

More
Bond and Materials Test Equipment

More
Technical Support Services

More
Further Information
Technical Downloads
File
Inseto Product Presentation Overview
Download