Equipment

Inseto’s Equipment Division provides manufacturing, test and inspection equipment for the Electronic, Microelectronic, Photonic, Photovoltaic and Semiconductor industries etc., including lithography equipment for mask alignment, resist coating and development, semiconductor furnaces, wafer bonders, probing systems, dicing saws and diamond scribing machines, die bonders and sorters, sinter bonding systems, inspection equipment, ultrasonic wire bonding machines, plasma cleaners and etching systems, vacuum solder reflow ovens, material testers for wire pull and shear testing etc.

Full technical support including process, operation and maintenance is provided, with extensively trained field personnel and information databases. Training either at Inseto’s training facility or onsite, can be provided to maximise equipment productivity and optimise quality of results.