Automatic Die Bond Equipment by Amadyne
Amadyne produce a range of fully automatic die bond equipment for the automation of production and R&D processes within the microelectronic and related, advanced semiconductor packaging sectors. Besides the standard die attach processes and applications, these versatile die attach systems can also be customised for virtually every micro-systems assembly operation and according to specific application requirements.
Flexibility, ease of operation and a wide variety of options on the equipment, enable the fabrication of standard and advanced devices, including capabilities for epoxy die bonding, eutectic die soldering, flip chip bonding, pickup from tape and reel, wafer or waffle pack, adhesive dispensing or stamping and inspection etc.
A sophisticated graphical user interface (GUI), common to all systems, simplifies both programming and operation. Features include: SQL server for product and library data, expert step-by-step guides during programming & calibration, wafer-substrate mapping, single component tracking & SPC monitoring, manual operating mode, online application support and networking for machine status, plus CAD import and offline programming.
FAB – Automatic Die Bond Equipment for Advanced Packaging
Automatic die bonder for inline or batch assembly with flexibility, accuracy and inspection capabilities.
CAT – Die Bonder Equipment for Batch Processing
The CAT is an automatic batch system capable of die and component assembly in a small footprint.
EMU – Flexible Die Bonder for Low Volume Assembly
The EMU is an entry level fully automatic die bonder for low volume and R&D applications.
Manual Die Bonder Equipment
Die Shear and Materials Test
Die Attach Tools
Die Attach Adhesives and Glob Tops
Tel: +44 (0)1264 334505
Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark