Die Bonding Equipment by Amadyne
Amadyne produce a range of automatic die bonding equipment used to pick and place, or sort semiconductor die and related components, in the microelectronic and advanced packaging sectors. Besides the standard die attach processes and applications, these versatile die attach systems can also be customised for virtually every micro-systems assembly operation and according to specific application requirements.
Flexibility, ease of operation and a wide variety of options on Amadyne’s die bond equipment, enable the fabrication of standard and advanced semiconductor devices. Capabilities include epoxy die bonding, eutectic die soldering, flip chip bonding, pickup from tape and reel, wafer or waffle pack, adhesive dispensing or stamping and inspection etc.
With a range of systems to choose from, Amadyne’s die bonding equipment provides automatic models for reasearch and development through production processes. A sophisticated graphical user interface (GUI), common to all machines, simplifies both programming for new product introduction and user operation.
For an introduction to die bonding process and factors to be taken into consideration, please look at our Knowledge Base Fact Sheet here. Further Knowledge Base articles related to die bonding, can be found detailed below.
FAB – Automatic Die Bonding Equipment for Advanced Packaging
Automatic die bonder for inline or batch assembly with flexibility, accuracy and inspection capabilities.
CAT – Automatic Die Bonder for Batch Processing
The CAT is an automatic batch system capable of die and component assembly in a small footprint.
EMU – Flexible Die Bonder for Low Volume Assembly
The EMU is an entry level fully automatic die bonder for low volume and R&D applications.
Manual Die Bonding Equipment
Die Shear and Materials Test
Die Attach Tools
Die Attach Adhesives and Glob Tops
Knowledge Base Articles
Adhesives for Die Attach (IKB-071)
Encapsulation Adhesives (IKB-013)
Understanding Ball Bond and Die Shar Testing (IKB-018)
MIL STD 883 Shear Testing (IKB-026)
Setting Up The Die Attach Process (IKB-072)
Tel: +44 (0)1264 334505
Die Bonding, Die Attach of Microelectronic Components, Hybrid Assembly, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Die Bond, Microsystems Assembly, RF & Microwave Assembly, Power Module Assembly, Component Pick & Place, Die Sort, Test Integration, Laser Bar Sorting, Stacking and Un-Stacking.
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fiber Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Research and Development, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark