Die Bonding Equipment by Amadyne

Amadyne produce a range of automatic die bonding equipment used to pick and place, or sort semiconductor die and related components, in the microelectronic and advanced packaging sectors. Besides the standard die attach processes and applications, these versatile die attach systems can also be customised for virtually every micro-systems assembly operation and according to specific application requirements.

Flexibility, ease of operation and a wide variety of options on Amadyne’s die bond equipment, enable the fabrication of standard and advanced semiconductor devices. Capabilities include epoxy die bonding, eutectic die soldering, flip chip bonding, pickup from tape and reel, wafer or waffle pack, adhesive dispensing or stamping and inspection etc.

With a range of systems to choose from, Amadyne’s die bonding equipment provides automatic models for research and development through production processes. A sophisticated graphical user interface (GUI), common to all machines, simplifies both programming for new product introduction and user operation.

For an introduction to die bonding process and factors to be taken into consideration, please look at our Knowledge Base Fact Sheet here. Further Knowledge Base articles related to die bonding, can be found detailed below.