Dispensing, Die Attach and Wire Bonding Equipment by Kulicke & Soffa

Kulicke & Soffa (K&S) are one of the world’s leading manufacturer of automatic assembly equipment for die attach, wire bonding and dispensing used throughout the semiconductor and related high-technology industries.

The precision range dispensing equipment includes bench top through inline systems developed for bonding, sealing and coating applications.

A series of die attach systems enable the latest advanced packaging processes, including wafer level, flip chip, thermocompression and hybrid bonding.

Wire bonding equipment includes automatic ball bonders for interconnecting microelectronic and semiconductor devices, high-speed bumping systems for up to 300mm wafers, plus wedge bonding systems for producing wire and ribbon interconnects used throughout the power electronic, battery and energy sectors.

In addition, K&S are one of the largest manufacturers of wire bonding capillaries producing standard designs to customised solutions that address different packaging challenges and application requirements. A range of hub blades for semiconductor and packaging processes help customers improve yields and increase wafer dicing productivity.

K&S - Kulicke and Soffa

Further Information

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Tel: +44 (0)1264 334505



Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Battery Packs, PCB Assembly, Displays

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Kulicke & Soffa (K&S) Website


United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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