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Automatic Wire Bonders & Consumable Products by Kulicke & Soffa

Kulicke & Soffa (K&S) are the world leaders for automatic wire bonders. The KnS gold wire bonders, copper stud bump / wire & aluminium ultrasonic wedge bonding systems are very easy to operate and are ideal for universities, development laboratories through to medium volume production facilities.

K&S - Kulicke and Soffa

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Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Kulicke & Soffa (K&S) Website

www.kns.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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