Automatic Wire Bonders & Consumable Products by Kulicke & Soffa
Kulicke & Soffa (K&S) are the world leaders for automatic wire bonders. The KnS gold wire bonders, copper stud bump / wire & aluminium ultrasonic wedge bonding systems are very easy to operate and are ideal for universities, development laboratories through to medium volume production facilities.
Automatic Wire Bonders: Ball & Bump
K&S produce a range of fully automatic gold ball bonding machines for high speed IC & MCM assembly.
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Automatic Wire Bonders: Wedge
K&S produce a range of fully automatic Wedge Bonders suitable for large wire, fine wire and power ribbon bonding.
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Automatic Die Bonders
K&S produce a range of fully automatic gold ball bonding machines for high speed IC & MCM assembly.
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Wire Bonding Capillaries
Capillaries for a broad range of applications, designed to suit all major brands of equipment.
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Dicing Blades
K&S produce a range of high-quality hubbed dicing blades for package and wafer singulation.
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Further Information
Applications
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa (K&S) Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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