Dispensing, Die Attach and Wire Bonding Equipment by Kulicke & Soffa

Kulicke & Soffa (K&S) are one of the world’s leading manufacturer of automatic assembly equipment for die attach, wire bonding and dispensing used throughout the semiconductor and related high-technology industries.

The precision range dispensing equipment includes bench top through inline systems developed for bonding, sealing and coating applications.

A series of die attach systems enable the latest advanced packaging processes, including wafer level, flip chip, thermocompression and hybrid bonding.

Wire bonding equipment includes automatic ball bonders for interconnecting microelectronic and semiconductor devices, high-speed bumping systems for up to 300mm wafers, plus wedge bonding systems for producing wire and ribbon interconnects used throughout the power electronic, battery and energy sectors.

In addition, K&S are one of the largest manufacturers of wire bonding capillaries producing standard designs to customised solutions that address different packaging challenges and application requirements. A range of hub blades for semiconductor and packaging processes help customers improve yields and increase wafer dicing productivity.