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Automatic Ball Bonders & Bumpers by Kulicke & Soffa

K&S produce a range of fully automatic gold ball bonding machines for high speed IC & MCM assembly, flexible large area hybrid markets and stud bumpers for up to 12″ wafers, as well as automatic die bonding systems. These systems provide higher productivity and yields, whilst enabling production of the most complex packages at the lowest cost.

K&S - Kulicke and Soffa

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development

Industry Segments

Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities

Kulicke & Soffa (K&S) Website

www.kns.com

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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