Automatic Ball Bonders & Bumpers by Kulicke & Soffa
K&S produce a range of fully automatic gold ball bonding machines for high speed IC & MCM assembly, flexible large area hybrid markets and stud bumpers for up to 12″ wafers, as well as automatic die bonding systems. These systems provide higher productivity and yields, whilst enabling production of the most complex packages at the lowest cost.
K&S Automatic Gold Ball Wire Bonders
The Power Series of Semiconductor Assembly Products are a new generation of semiconductor assembly equipment.
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K&S Automatic Wafer Bumpers
The AT Premier™ Stud Bumper offers many technological advantages that make it the ideal choice for a wide range of flip chip product applications.
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K&S Die / Wire Bonding Capillaries & Hub Dicing Blades
K&S offers a full range of wafer dicing blades and PCB package dicing blades.
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K&S – Kulicke and Soffa
See the full K&S product range
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Further Information
Applications
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa (K&S) Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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