Automatic Ball Bonder: RAPID Pro
K&S RAPID Pro Key Features
- Fully Automatic Ball Bonder with Advanced Capabilities
- Real-time Process and Performance Monitoring
- Industry 4.0 Communication
- Equipment Health Monitoring
- Advanced Data Analytics and Traceability
- Detection and Enhanced Post bond Inspection
RAPID™ Pro is the first in the new GEN-S Series, or Smart Generation of High Performance Ball Bonder from Kulicke and Soffa that introduces smart wire bonding capabilities.
RAPID Pro provides advanced wire bonding with real-time monitoring and diagnostics to ensure the highest yield possible for automotive, aerospace, defence, bio-medical and other high performance applications.
These advanced wire bonding capabilities includes:
Real-time Process & Performance Monitoring: Real-Time Process Monitoring (RPM) enhances the ball bonder’s ability to prevent failure and improve reliability. A new control system allows RPM to analyze internal signals that have a direct correlation to bond quality and bonder performance. RPM data is captured and analyzed in real-time by the bonder’s control system so the bonder can be stopped when process variation is detected. This information is also offers traceability of all data, for long-term analysis.
Equipment Health Monitoring: Real-time Equipment Health Monitoring of key subsystem health and performance, including: USG System, XYZ System, Temperature, Crosshair Offset, & Heatblock Height. Users can define limits for critical subsystem health indicators. The ball bonder will analyze trends in the data and provide Predictive Maintenance warnings.
Advanced Data Analytics & Traceability: Quickly access and visualize performance data for recent history of Ball deformation, ball diameter, ball placement,missing bonds, PRS alignment, Die Height, Placement, Rotation, and tilt.
Detection & Enhanced Post bond Inspection: Monitors, detects, and corrects bond placement errors. Eliminates operator errors during capillary change or during assist. Fully programmable inspection and sampling settings.
Latest Response Based Processes: Includes ProCu-6, ProAu-2, ProAg, PSP-Cu, PSP-Ag and ProCu Loop.
- 0.6 mil to 2.5 mil copper, silver, or gold wire
- 35 μm inline bond pad pitch
- Bond placement accuracy 2.0 μm at 3 sigma
- Upward compatible with all standard processes from existing models
- High performance X-Y-Z motion control system
- On-board process optimization tools
- Higher Resolution Progressive Scan Vision System
- Optional Programmable Focus for High Magnification
Bonding Wire and Ribbons
Bond and Materials Test Equipment
Manual Wire Bonders
Technical Support Services
Knowledge Base Articles
What is Wire Bonding? (IKB-015)
Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
Understanding Wire Pull Testing (IKB-003)
Ball Bond Sequence (IKB-001)
Kulicke & Soffa Capillary Nomenclature (IKB-011)
Bonding Wire Sizes and Selection (IKB-037)
Bond Wire Handling Considerations (IKB-023)
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa (K&S) Website
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