Automatic Wedge Wire Bonders by Kulicke & Soffa
K&S is the world leading manufacturer of wire and ribbon bonding equipment for power semiconductors, power modules, batteries and hybrid electronic devices.
K&S wedge bonders ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 – 80 x 12 mils).
For over 45 years, K&S wedge bonder products have been recognized for exceptional performance, reliability, and excellent after-sales support. Its bonders are created to cater to industries’ needs of smaller, thinner, and denser semiconductor packages.
Suitable for large wire wire and ribbon bonding of microelectronic devices and smaller battery packs etc.
An expanded bondable area designed heavy wire or ribbon bonding of large area microelectronic devices and mid sized battery packs.
Incorporates a much larger bondable area designed for ultrasonic wire or ribbon bonding of larger sized battery packs.
Designed for cassette to cassette or inline lead-frame bonder for Power Semiconductor devices.
K&S – Kulicke and Soffa
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Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa (K&S) Website
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark