Automatic Wedge Wire Bonders by Kulicke & Soffa
K&S is the world leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 – 80 x 12 mils).
For over 45 years, K&S wedge bonder products have been recognized for exceptional performance, reliability, and excellent after-sales support. Its bonders are created to cater to industries’ needs of smaller, thinner, and denser semiconductor packages.
The K&S Asterion Wedge Bonder is suitable for large wire, fine wire and power ribbon bonding of Microelectronic Devices etc.
Asterion-EV Battery Bonder
The K&S Asterion-EV Wedge Bonder incorporates an expanded bondable area designed for ultrasonic battery wire or ribbon bonding.
The K&S Orthodyne PowerFusion is a cassette to cassette or inline lead-frame bonder for Power Semiconductor devices.
K&S – Kulicke and Soffa
See the full K&S product range
Manual Wire Bonders
Bond and Materials Test Equipment
Bonding Wire and Ribbons
Die Attach Adhesives and Glob Tops
Tel: +44 (0)1264 334505
Microelectronic Devices, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nano-electronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa (K&S) Website
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