Automatic Wedge Wire Bonders by Kulicke & Soffa

K&S is the world leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminium wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminium ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 – 80 x 12 mils).

For over 45 years, K&S wedge bonder products have been recognized for exceptional performance, reliability, and excellent after-sales support. Its bonders are created to cater to industries’ needs of smaller, thinner, and denser semiconductor packages.