Semiconductor Leadframe Wedge Bonder: Powerfusion
PowerFusion Key Features
- Semiconductor Leadframe Wedge Bonder
- Ultrasonically bonds large wire, fine wire and ribbon
- Faster cycle time with direct-drive XYZT motion system
- Exceptional bonding quality and reliability
- Available in single, dual or multi-head configurations
The K&S PowerFusion is a cassette to cassette or inline lead-frame bonder for Power Semiconductor devices.
KnS PowerFusion Wedge Bonders are driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and reliability. Systems are available in single, dual or multi-head configurations.
Three models of PowerFusion bonders are available. The TL Model is the perfect choice for bonding TO power devices while the HL Model provides the accuracy and capability required to process the most advanced power packages. The HLx Model can handle extra-wide matrix and IPM lead-frames up to 105 mm wide.
The TL Model is the perfect choice for bonding single-row to four-row matrix TO power devices. PowerFusionPS’s industry leading productivity reduces your manufacturing costs and delivers optimum pattern recognition and superior bonding performance. It is upgradeable to the HL Model should advanced packaging requirements be in your future.
The HL Model is specially designed to enable large wire, small wire and PowerRibbon bonding in advanced packaging designs. Whether you are bonding high density power devices like SO-8 & PDFN or stretching the wire limit on a matrix D-Pak, the superior indexing accuracy and clamping capabilities of the HL Model deliver consistent quality.
The HLx Model has all the capabilities of the HL Model with the added benefit of handling leadframes up to 105 mm wide. Whether you have a current requirement for wide leadframe processing or just want to invest in a flexible platform for future leadframe development, the HLx Model is the best choice for many applications.
Wire Bond Wedge Tool
Bonding Wire and Ribbons
Bond and Materials Test Equipment
Technical Support Services
Knowledge Base Articles
Fine Wire Wedge Bond Sequence (IKB-002)
Heavy Wire Wedge Bonding Cycles (IKB-057)
KnS Understanding Pattern Recognition (IKB-033)
Understanding Wire Pull Testing (IKB-003)
MPP Bonding Wedge Tool Nomenclature (IKB-010)
MPP Ribbon Wedge Tool: Slot Size to Ribbon Size Recommendations (IKB-066)
Bonding Wire Sizes and Selection (IKB-037)
Bond Wire Handling Considerations (IKB-023)
Tel: +44 (0)1264 334505
Wedge Small & large Wire or Power Ribbon Bonding of Semiconductor Lead-frame Devices
Automotive, Power Semiconductor Assembly
Kulicke & Soffa (K&S) Website
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark