Bond Test and Micro-Materials Testing Equipment by Nordson Dage

Nordson DAGE manufactures a leading range of bond test equipment and micro-materials test equipment for the destructive and non-destructive testing of electronic components and related devices. The equipment is used worldwide for quality assurance and failure analysis purposes in the aerospace, automotive, consumer, medical and advanced technology sectors.

Bond test methods include wire pull, bond shear, die shear, tweezer pull, die stud pull etc., whilst micro-materials test methods include flex-bend and push-pull etc.

Nordson-DAGE systems are optimized for manual through to automated testing of microelectronic packages such as multi-chip-modules, chip scale packages, plus other electronic component and material test applications, such as connector testing, PCB material and substrates analysis etc.

Continuous hardware and software development has ensured that new machines and test methods are swiftly introduced. A philosophy that has most recently led to the development & introduction of the 4600 automated bond test system and the 4800 wafer level bond tester.

Dage, a leading manufacturer and supplier of Bond Test and Micro Materials Testing Equipment.

Further Information

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Tel: +44 (0)1264 334505



Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Nordson-DAGE Website


United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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