Bond and Materials Test Equipment by Nordson Dage
Nordson DAGE has a strong portfolio of bond and materials testing equipment for destructive and non-destructive mechanical test and inspection of electronic components including wire pull, bond shear, die shear, tweezer & stud pull, fatigue testing and materials testing etc.
With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as MCM’s, Hybrids, BGAs, Chip Scale Packages (CSP) and other electronic components and materials.
Their commitment to continuous development has ensured that products are brought swiftly to market to support customers in emerging and advanced technology sectors. A philosophy that has most recently led to the development & introduction of the automated bond test platforms and micro materials test systems.
Multi-Function Bond Tester – 4000 Optima
The Nordson DAGE 4000 Optima is optimised for accurate and reliable high speed bond testing.
Micro Materials & Bond Tester – 4000 Plus
The Nordson DAGE4000 Plus is the most advanced bond tester on the market, ideal for QA & FA applications.
Automated Bond Tester – 4600
The Nordson DAGE4600 Bondtester is a bench top system, with operator free testing by using a high accuracy stage and on-board camera’s.
Micro-Materials Test Equipment – Prospector
The Nordson DAGE Prospector provides a complete suite of micro-materials testing capability within one system.
Wafer Level Bond Tester – 4800
The 4800 has been developed to address the specific needs of wafer bond testing of up to 450mm wafers.
Automatic Die Bonders
Manual Die Bonders
Automatic Wire Bonders
Die Attach Adhesives and Glob Tops
Bonding Wire and Ribbons
Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark