Bond and Materials Test Equipment by Nordson Dage

Nordson DAGE has a strong portfolio of bond and materials testing equipment for destructive and non-destructive mechanical test and inspection of electronic components including wire pull, bond shear, die shear, tweezer & stud pull, fatigue testing and materials testing etc.

With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages such as MCM’s, Hybrids, BGAs, Chip Scale Packages (CSP) and other electronic components and materials.

Their commitment to continuous development has ensured that products are brought swiftly to market to support customers in emerging and advanced technology sectors. A philosophy that has most recently led to the development & introduction of the automated bond test platforms and micro materials test systems.

Dage Bond Testing and Micro Materials Test Equipment

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Further Information

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Tel: +44 (0)1264 334505



Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Nordson-DAGE Website


United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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