Bond Test and Micro-Materials Testing Equipment by Nordson Dage
Nordson DAGE manufactures a leading range of bond test equipment and micro-materials test equipment for the destructive and non-destructive testing of electronic components and related devices. The equipment is used worldwide for quality assurance and failure analysis purposes in the aerospace, automotive, consumer, medical and advanced technology sectors.
Nordson-DAGE systems are optimized for manual through to automated testing of microelectronic packages such as multi-chip-modules, chip scale packages, plus other electronic component and material test applications, such as connector testing, PCB material and substrates analysis etc.
Continuous hardware and software development has ensured that new machines and test methods are swiftly introduced. A philosophy that has most recently led to the development & introduction of the 4600 automated bond test system and the Prospector, micro materials test system.
Bond Test Equipment: 4000 Optima
Accurate high speed bond testing, including wire pull, bond shear, die shear and pull etc.
Automated Bond Test Equipment: 4600
Operator free wire pull or shear testing, utilizing high accuracy motion control and on-board camera’s.
Wafer Level Bond Tester: 4800
Developed to address the specific needs of wafer bond bump shear testing on up to 450mm dia. wafers.
Bond & Micro Materials Test Equipment: 4000 Plus
The Nordson DAGE4000 Plus is the most advanced bond tester on the market, ideal for QA & FA applications, plus materials test methods.
Micro-Materials Test Equipment: Prospector
The Nordson DAGE Prospector provides a complete suite of micro-materials testing capabilities within one system, plus bond test methods.
Bond Test & Material Test Methods
An overview of the different type of bond test and micro-materials test methods performed on Nordson-DAGE bond testing equipment.
Automatic Die Bonders
Manual Die Bonders
Automatic Wire Bonders
Die Attach Adhesives and Glob Tops
Bonding Wire and Ribbons
Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark