Wire Pull & Bond Shear Tester: Dage 4000 Optima
Dage 4000 Optima Key Features
- Wire Pull Test & Shear Tester for R&D, QA or Production
- Bond Shear, Die Shear & Component Shear Test
- Fine Wire or Large Wire Pull Test
- Quick & easy to interchange between test types
- Compatible with existing 4000 Series Test Cartridges
- New unique Multi-Function Cartridges
- Patented air bearing technology for shear testing
- Excellent ergonomics
- Intuitive Paragon™ software interface
Dage 4000 Optima Bond & Shear Tester overview:
The Nordson DAGE 4000 Optima is dedicated for microelectronic and related bond testing applications, including pull test of wire bonds, ball bond shear, die shear and tweezer pull etc. The machines are used in research, production and quality assurance environments.
The systems patented technology for frictionless bond or die shear and superior ergonomics ensures repeatable and reproducible results, combined with an excellent user experience. It’s Paragon™ software, features a highly configurable and intuitive interface, as well as a wide variety of advanced functionality, such as automatic GR&R calculation, built-in diagnostics, a unique database search engine wizard and superior reporting.
In addition to a range of dedicated test Cartridges, which allow users to perform wire pull tests from 0.25 grams to 50 kilograms and bond or die shear testing from 0.25 grams right through to 200 kilograms, Nordson-Dage have introduced the unique Multi-Function Cartridges (MFC’s), which combine multiple tests in one Cartridge and can switch test modes in just seconds. A range of MFC’s are available, including: 250 gram bond shear / 5kg shear and 100 gram wire pull, or 20kg die shear / 1kg wire pull and 10kg wire pull etc.
A range of high-speed XY stages, with a 160mm XY stage as standard, meets a wide range of requirements. The image capture system for advanced analysis is quick to set-up and in close proximity to the test head aiding faster testing.
Cartridge Compatibility & Correlation:
Nordson DAGE recognizes that data correlation is fundamental for cross referencing test results between old and new platforms. Existing users of Nordson DAGE bondtesters (4000 and 5000) can not only use their existing Bond Test Cartridges on the new Optima but also confidently compare the pull and shear test data between old and new machines.
4000 Optima – Test Methods Include:
Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks including: Ball Shear/Solder Ball Shear, Cold Bump Pull, Die Shear, First Bond Ball Pull/Stud Bump Pull, High Force Pull, High Strain Rate, Ribbon Peel, Ribbon Pull, Stud Pull, Tweezer Pull, Vector Pull, Wedge Shear, Wire Pull & Zone Shear.
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark