Advanced Wire Bond Pull & Shear Tester: Dage 4000 Optima
Dage 4000 Optima Key Features
- Super quick wire Pull and ball Shear Test Speeds
- Quick & easy to interchange with single load Test Cartridges
- Compatible with existing 4000 Test Cartridges
- New unique Multi-Function Cartridges
- Correlation / GR&R / MSA between all 3 Dage platforms
- Frictionless pull to true load (MFC)
- Patented air bearing technology for shear testing
- Excellent ergonomics
- Optimised Microscope Vibration / Reduction
- Intuitive Paragon™ software interface
Dage 4000 Optima Wafer Level Bond Tester overview
The new Nordson DAGE 4000 Optima is dedicated for bond testing applications in production and engineering environments, including wire pull, bond shear, die shear and tweezer pull etc.
The new systems patented technology and superior ergonomics ensures repeatable and reproducible results, combined with an excellent user experience. It’s Paragon™ software, features a highly configurable and intuitive interface, as well as a wide variety of advanced functionality, such as automatic GR&R calculation, built-in diagnostics, a unique database search engine wizard and superior reporting.
In addition to a range of dedicated test Cartridges, which allow users to perform pull tests from 0.25 grams to 50 kilograms and shear testing from 0.25 grams right through to 200 kilograms, Nordson-Dage have introduced the new and unique Multi-Function Cartridges (MFC’s), which combine multiple tests in one Cartridge and can switch test modes in just seconds! Two MFC’s are available: 250 gram shear / 5kg shear and wire pull 100 gram, or 20kg shear / 1kg pull and 10kg pull.
Two new and unique Multi-Function Cartridges (MFC’s), which combine multiple tests in one Cartridge and can switch test modes in just seconds! Two MFC’s are available: 250 gram shear / 5kg shear and wire pull 100 gram, or 20kg shear / 1kg pull and 10kg pull.
A range of XY stages, with a 160mm XY stage as standard, meets a wide range of requirements. The image capture system for advanced analysis is quick to set-up and in close proximity to the test head aiding faster testing.
The 4000 Optima utilizes Paragon™ software which boasts a highly configurable and intuitive interface as well as a wide variety of advanced functionality such as automatic GR&R calculation, built-in diagnostics, a unique database search engine wizard and superior reporting.
Cartridge Compatibility & Correlation
Nordson DAGE recognizes that data correlation is fundamental for cross referencing test results between old and new platforms. Existing users of Nordson DAGE bondtesters (4000 and 5000) can not only use their existing Test Cartridges on the new Optima but also confidently compare data between old and new machines.
Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks including: Ball Shear/Solder Ball Shear, Cold Bump Pull, Die Shear, First Bond Ball Pull/Stud Bump Pull, High Force Pull, High Strain Rate, Ribbon Peel, Ribbon Pull, Stud Pull, Tweezer Pull, Vector Pull, Wedge Shear, Wire Pull & Zone Shear.
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark