Wire Pull Test: Microelectronic Devices
Wire Pull Test Overview:
- Pull Testing Fine & Large Wire Diameters
- Manual and Automated Wire Pull Testing
- Test Wire and Ribbons
- Vector Pull Test
- Destructive and Non-Destructive Testing
- Test According to MIL-STD-883 Standards
Wire pull test is used as a process control method to determine 1st and or 2nd bond adhesion. Ideally, wires should break mid-span when pull tested but loop height, bond quality, bonding method and to a lesser degree operator or hook type, will all influence the test results.
The principle behind basic wire bond pull testing, is positioning of a hook underneath the wire and pulling in the Z axis either until the bond breaks (destructive testing) or a pre-defined force is reached (non-destructive testing).
Wire bond testing is covered by the external standard MIL-STD-883 (Methods 2011.7 for destructive testing and 2023.5 for non-destructive). Nordson DAGE bondtesters fully conform to or exceed these standards. The standards contain specifications for acceptance or rejection criteria.
Pull testing is performed on:
- Fine wire diameters (typically 12.5 to 75 micron)
- Large wire diameters (typically 100 to 500 micron)
- Ribbons (typically up to 2000 x 250 microns)
Pull test Cartridges are available that cover a range of pull forces and allow destructive or non-destructive testing. An appropriate hook should also be used, which in the case of wire bonds, is a minimum of 2x the wire diameter being tested.
Vector wire pull testing simulates a perpendicular test angle between the two wire bonds, when the surface heights for each bonds are different. This is achieved by coordinating the X-Y and Z axis of the wire pull tester, so the test is performed at the required optimized angle.
Small geometry (Ultra Fine Pitch) applications are becoming more and more popular and as such Nordson DAGE offers wire pulling test equipment specifically for this function.
A wire pull test can be performed manually or semi-automatically to a pre-programmed test routine.
Wire Pull Test – Available on:
4000 Optima: Bond Test Equipment
4600: Automated Bond Test Equipment
4000 Plus: Bond & Materials Test Equipment
Prospector: Advanced Materials Test Equipment
Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Ribbon Pull, Vector Pull
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Available from Inseto in the United Kingdom, Ireland, Sweden, Denmark, Norway and Finland