Bond Testing Systems by Nordson Dage

Nordson DAGE has a strong portfolio of products for destructive and non-destructive mechanical testing and inspection of electronic components including wire pull, bond shear, die shear, tweezer & stud pull, fatigue testing etc.

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505



Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.

Industry Segments

Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices

Nordson-DAGE Website


United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

Request Form