Bond Testing Systems by Nordson Dage
Nordson DAGE has a strong portfolio of products for destructive and non-destructive mechanical testing and inspection of electronic components including wire pull, bond shear, die shear, tweezer & stud pull, fatigue testing etc.
Bond and Materials Test Equipment
With its self-contained R&D facilities, Nordson DAGE has developed world-leading products for testing wire bonds on semiconductor packages.
Automatic Die Bonders
Manual Die Bonders
Automatic Wire Bonders
Die Attach Adhesives and Glob Tops
Bonding Wire and Ribbons
Tel: +44 (0)1264 334505
Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark