Fully Automatic Dicing Saws

ADT manufacture two series of fully automatic dicing saw, including the 7022 single spindle system and 8020 twin spindle system, which offers increased throughput and reduced cost of ownership.

Both systems are available with standard power spindles for dicing silicon or similar materials and in higher power versions for thicker or harder materials.

ADT - Advanced Dicing Technologies

Further Information

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Tel: +44 (0)1264 334505



Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing

ADT Website


Available from Inseto in the United Kingdom, Ireland & Scandinavia

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