Fully Automatic Dicing Saws
ADT manufacture two series of fully automatic dicing saw, including the 7022 single spindle system and 8020 twin spindle system, which offers increased throughput and reduced cost of ownership.
Both systems are available with standard power spindles for dicing silicon or similar materials and in higher power versions for thicker or harder materials.
Fully Automatic Dicing Systems 7220 Series
The 7220 Single Spindle Series for advanced automated dicing of wafers and hard materials.
Fully Automatic Dicing Systems 8020 Series
The 8020 Series feature twin facing spindles that can simultaneously dice wafers at high throughput.
ADT – Advanced Dicing Technologies
See the full ADT Dicing Equipment product range
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
Available from Inseto in the United Kingdom, Ireland & Scandinavia