Manual & Semi-Automatic Dicing Saws
With high accuracy cutting, high and lower power, single or dual spindle and large area options, ADT offer the most comprehensive range of manual and semi-automatic dicing systems, models include:
Semi-Automatic Dicing Systems
ADT’s 7120 Series of Semi-automatic Dicing Systems for 50-200mm devices, cover the full spectrum of dicing materials.
Large Area Dicing Systems
ADT produce a range of high-precision large area dicing systems for up to 450x600mm devices.
Dual Spindle Semi-Automatic Dicing Systems 7900
The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time.
ADT – Advanced Dicing Technologies
See the full ADT Dicing Equipment product range
Tel: +44 (0)1264 334505
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
Available from Inseto in the United Kingdom, Ireland & Scandinavia