Inseto
Inseto

Manual & Semi-Automatic Dicing Saws

With high accuracy cutting, high and lower power, single or dual spindle and large area options, ADT offer the most comprehensive range of manual and semi-automatic dicing systems, models include:

ADT - Advanced Dicing Technologies

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing

ADT Website

www.adt-co.com

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

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