Dual Spindle Semiautomatic Dicing Series 7900Duo

7900 Key Features

  • Advanced dual spindle wafer dicing system
  • Models for up to 200x200mm or 250x250mm devices
  • Quick alignment function for broken or partial wafers
  • Low vibration spindles enable superb cut quality
  • Small footprint & low cost of ownership

The 7900 Series – Taking your productivity to the edge.

As part of the growing market to dice small discrete devices and the on-going demand to lower the cost of production per unit, ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.

The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.

7900 Series Advantages:

  • Two facing spindles enable simultaneous dicing
  • Low vibration platform
  • Fast automatic alignment and cut positioning increase throughput
  • Small footprint reduces cost of ownership
  • Automatic Kerf inspection increase yield
  • Automatic Y offset correction ensures maximum precision
  • Tape surface detection ensures consistent cut quality
  • Touch screen user interface

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LED wafer dicing, Dicing Semiconductor Wafers, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.

Industry Segments

LED, Laser, Diode, Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries.

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Available from Inseto in the United Kingdom, Ireland & Scandinavia

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