Semiautomatic Dicing Series 7120 / 7130
7120/7130 Series Key Features
- Available with either 2″ and 4″ dicing spindles
- Advanced automatic vision alignment capabilities
- Designed for high reliability and low maintenance
- Precision structure for superior accuracy and repeat-ability
- Increased yield, throughput and process control
- Unique multi-panel processing capabilities
- Special blade wear forecast algorithm
- User-friendly software platform
ADT’s 7120 Series of Semiautomatic Dicing Systems for 50-200mm devices, cover the full spectrum of dicing materials from IC wafers to multi-panel dicing of pcb packages and hard material applications. The systems offers the lowest possible cost-of-ownership, whilst providing the most advanced dicing technology.
Featuring front mount high precision air bearing spindles, with options for 2″, 3″, 4″ and 5″ dicing blades for thin through thick devices, the systems are capable of cutting or scribing up to 8″ x 8″ area.
The various models are equipped with close loop turn table and optimized for variety of products such as: Silicon wafers, Thin-film devices, High-brightness LED Packages, SAW Filters, Glass/Silicon, PZT, ceramics and more.
Tel: +44 (0)1264 334505
Manual and Semiautomatic Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices, Glass Device Processing
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing
Available from Inseto in the United Kingdom, Ireland & Scandinavia