Inseto

Semiautomatic Dicing Saw 7120 / 7130 Series

Semiautomatic Dicing Saw 7120/7130 Series:

  • Available with either 2″ and 4″ dicing spindles
  • Advanced automatic vision alignment capabilities
  • Designed for high reliability and low maintenance
  • Precision structure for superior accuracy and repeat-ability
  • Increased yield, throughput and process control
  • Unique multi-panel processing capabilities
  • Special blade wear forecast algorithm
  • User-friendly software platform

ADT’s 7120/7130 Series of Semiautomatic Dicing Saw’s for 50-300mm devices, cover the full spectrum of dicing materials from semiconductor wafers to PCB packages, glass and ceramics etc.

Featuring high-precision air bearing spindles, close loop wafer stages, user friendly software, advanced vision and real-time process monitoring, the systems deliver the optimum in quality, reliability and performance.

The series offer the lowest possible cost-of-ownership, whilst providing the most advanced dicing technology, with models optimised for specific applications.

ADT’s 7120/7130 series of semiautomatic dicing saw models include:

7122 Semiautomatic Dicing Saw – for dicing thin materials such as semiconductor wafers up to 200mm diameter or PCB panels up to 200mm x 200mm square.

7124 Semiautomatic Dicing Saw – for dicing thick and hard materials such as glass, optical filters and ceramics up to 200mm diameter or 200 x 200mm square.

7132 Semiautomatic Dicing Saw – for dicing thin materials such as semiconductor wafers up to 300mm diameter or PCB panels up to 300mm x 225mm square.

7134 Semiautomatic Dicing Saw – for dicing thick and hard materials such as glass, optical filters and ceramics up to 300mm diameter or 300 x 225mm square.

Example Applications

Wafer Dicing

Compound Wafer Dicing

LTCC Dicing

Package Singulation

PZT Dicing

Related Products

Knowledge Base Articles

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Applications

Manual and Semiautomatic Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices, Glass Device Processing

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing

ADT Website

www.adt-co.com

Region

Available from Inseto in the United Kingdom, Ireland & Scandinavia

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