Semiautomatic Large Area Dicing Systems
7120/7130 Series Key Features
- Series of large dicing systems for up to 450x600mm devices
- Unique multi-panel processing capabilities
- Advanced hardware platform for high reliability & low maintenance
- High & low power Spindle options
- Customized chucks configurations
- Increased theta precision for high accuracy over long cut lengths
- Spacious load & unload area for large substrates
ADT produce a range of high-precision large area dicing systems for processing up to 300mm (12″) wafers, in addition to the cutting of large PCB substrates or hard and brittle glass and ceramic substrates. Whilst the 7100XLA model can handle even larger substrates, PCB and other devices up to 450x600mm in size. All systems are available with either 2″ or 4″ spindles.
For cutting hard and thick materials, the systems include high power 4″, DC-brushless, 2.5 kW, Air-bearing Spindles (30 krpm Max.), with closed-loop turntable. These are optimised for high-precision, multi-panel dicing of thick applications up to 450 mm x 600 mm panels etc.
For processing up to 300mm silicon wafers, the systems feature front mount 2″ air bearing spindles for up to 1.2KW at 60krpm. A DC Brushless motor provides close-loop speed control. These models are compatible with 2″ – 3″ hub and annular blades.
Tel: +44 (0)1264 334505
Dicing Semiconductor Large Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribbing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Separation etc., PCB Dicing, Passive Component and Green Ceramic Dicing.
Semiconductor Production, University Research, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics and Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries.
Available from Inseto in the United Kingdom, Ireland & Scandinavia