966 Manual Wafer Mounter

966 Key Features

  • Versions for up to 200mm and 300mm wafers
  • Versions for square substrates and panels
  • Uniform mounting without air bubbles
  • Compatible with UV or regular tapes
  • Built-in reeling and removal of UV tape backing
  • Engraved chuck markings aid substrate alignment
  • Compatibility with all film frames; linear & circular tape cutting

The 966 Manual Wafer Mounter from ADT is a small footprint system for bubble-free mounting onto standard or UV tapes, for up to 200mm or 300mm wafers or devices.

The systems incorporate a configurable wafer chuck with optional soft contact materials for thin or fragile wafers etc., non-contact capabilities for sensitive or bumped wafers and multi-panel or custom options, plus are compatible with all film frame types, including linear and circular.

Features include:

  • Handles wafers up to 200mm or 300mm
  • Compact, table-top design
  • Controlled- temperature platen
  • Built-in vacuum generator
  • Uniform tape tensioning
  • Adjustable Spring-Loaded Platen
  • Custom chucks
  • UV tape liner removal
  • Bubble free Mounting
  • Optional non-contact mode

966 – 8″ Wafer Mounter Specifications

Max. wafer size:

Ø 200 mm*

Max. tape width:

300 mm

Plate heating:

Up to 80°C

Dimensions (WxDxH):

304 x 800 x 394 mm

Approx. weight:

30 kg

966 – 12″ Wafer Mounter Specifications

Max. wafer size:

Ø 300 mm*

Max. tape width:

400 mm

Plate heating:

Up to 80°C

Dimensions (WxDxH):

330 x 1000 x 560 mm

Approx. weight:

60 kg

*Refers to standard models

Further Information

Contact Us

Tel: +44 (0)1264 334505



Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices

Industry Segments

Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing

ADT Website


Available from Inseto in the United Kingdom, Ireland & Scandinavia

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